FY27 Maintenance 3/8" Chip Seal Aggregate Material
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
Solicitation MO27-11 is a request for proposal issued by the Idaho Maintenance Operations agency for FY27 Maintenance 3/8 inch Chip Seal Aggregate Material. The procurement process is managed through the ACHD eProcurement Portal, with a final response deadline of September 23, 2026. A bid opening will be conducted via Zoom, and all inquiries must be submitted exclusively through the portal's Question and Answer section by the specified deadline to be considered. The project is based in Boise, Idaho, and is overseen by Maintenance Manager Lloyd Carnegie and Procurement and Contracting Administrator Mike Fagerness. Interested parties must adhere to the strict communication protocols, as questions submitted via email, phone, or manual delivery will not be accepted.
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