High-Frequency PCB Manufacturing and Assembly
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
The contract requires the manufacture and assembly of high-frequency printed circuit boards specifically for RFCBA units, with strict adherence to impedance control and RF shielding standards. The work involves integrating both custom-designed and commercial off-the-shelf components, demanding precision in material selection, layer stacking, and signal integrity to ensure optimal RF performance. All processes must meet military-grade specifications for reliability and environmental resilience under demanding operational conditions. Performance is scheduled to take place in Warner Robins, with a response deadline of August 22, 2026. Classified under NAICS code 334418 for electronic component and product manufacturing, the agreement is structured as a subcontract under the Department of Defense, specifically managed by the FA8507 Alcmc Eskc office. The scope demands full compliance with advanced RF electronics standards and includes rigorous quality assurance protocols to support mission-critical applications.
General Info
Agency
NAICS
Place of Performance
Warner Robins, GA, USASet-Aside
Documents
This scope was carved out of FA8507_RFCBA_SourcesSought.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Radio Frequency Calibration Backplane Assembly (RFCBA)
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Timeline
Response Deadline
Organization & Contact Information
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