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HMI Panel Repair and Modification Services

Active

Federal

Response Deadline12/04/2026, 08:30:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract for HMI Panel Repair and Modification Services involves the teardown, evaluation, repair, and modification of Lower HMI Panel Assemblies supporting US Navy NAVICP-MECH projects. The scope of work requires the contractor to disassemble panels to identify faults and perform technical repairs to ensure units are restored to new-unit functionality. All items must be marked according to MIL-STD-130, REV N, and packaged in compliance with MIL-STD-2073 after utilizing specialized testing equipment to verify that each assembly is fully operable. Managed by the Department of Defense under the Navsup Weapon Systems Support Mech agency, the contract falls under NAICS code 811212. The primary objective is the delivery of one restored and functional Lower HMI Panel Assembly. The solicitation was posted on November 4, 2026, with a response deadline set for December 4, 2026.

General Info

Subcontract for repair and modification of one US Navy Lower HMI Panel Assembly.

Agency

Department Of Defense → Navsup Weapon Systems Support Mech

NAICS

811212 - Computer and Office Machine Repair and Maintenance

Place of Performance

PA

Set-Aside

NONE

Documents

This scope was carved out of N0010427QNA47.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

LOWER HMI PANEL ASS

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Timeline

PostedNov 4

subcontract

Response DeadlineDec 4

Submission deadline

Response Deadline

12/04/2026, 08:30:00 PM UTCin about 1 month

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Organization & Contact Information

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AgencyDepartment Of Defense → Navsup Weapon Systems Support Mech

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → Navsup Weapon Systems Support Mech

Office AddressN/A

ContactsNo contact information available

Full Description

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Performs teardown, evaluation, repair, and modification of Lower HMI Panel Assemblies for prime contractors on US Navy NAVICP-MECH projects. Disassembles panels to identify faults, executes technical repairs to restore units to new-unit functionality, and marks items per MIL-STD-130, REV N. Utilizes testing equipment to verify operable condition and packages per MIL-STD-2073. Delivers one restored and functional Lower HMI Panel Assembly.

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