This Government Contract opportunity from Department Of Justice was posted on June 14, 2010. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
HSP10G CARDS
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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The Department of Justice, specifically the FBI-JEH, issued award notice RFQ_E010148 on June 14, 2010, for HSP10G CARDS under NAICS code 334412. The contract involves the procurement and technical assembly of Highspeed Processor 10G systems, specifically focusing on the HSP10G Daughter Card and Power Daughter Board developed by BAE Systems. The project encompasses complex hardware requirements, including the fabrication of 16-layer and 6-layer printed circuit boards using specialized materials such as Nelco 4000-13EP and Isola 370HR, featuring immersion gold finishes and strict adherence to ITAR compliance and IPC 6012 Class 2 standards. Technical execution is supported by extensive documentation, including detailed bills of materials, polar impedance reports, and electrical schematics for power sequencing and interface components like PCI Express and GIGE PHY. The manufacturing process is guided by precise CNC parameter configurations, Gerber RS274X files, and pick-and-place component placement data. Final assembly instructions specify rigorous hardware standards, including specific torque requirements for brackets and daughter card integration to ensure system integrity.
General Info
Contract Value
$290,215.5Place of Performance
DCSet-Aside
Award Issued Date
Documents
17AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
More opportunities from Department Of Justice → Fbi-Jeh
Same awarding agency
Earlier notices in this NAICS code
Posted before this notice, open and closed
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