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Inductively Coupled Plasma (ICP) Processing Module

Active

Canada

Response Deadline06/29/2026, 07:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The contract involves the supply and delivery of an Inductively Coupled Plasma (ICP) etch module designed to be compatible with the existing KLA/SPTS Omega fxP platform, which is utilized in semiconductor fabrication processes. This subcontract opportunity is issued by the National Research Council of Canada, under the Government of Canada, and targets suppliers capable of providing advanced equipment for semiconductor manufacturing technologies. The solicitation was posted on June 12, 2026, with a response deadline of June 29, 2026, indicating a relatively short window for submission. The contract falls under the NAICS code 333242, which relates to semiconductor and other electronic component manufacturing machinery. The work will be performed in Canada, aligning with the government’s efforts to support domestic technology and research capabilities in high-tech sectors. Interested parties are prompted to respond promptly, considering the firm deadlines and specialized nature of the contract.

General Info

Supply and delivery of ICP etch module compatible with KLA/SPTS Omega fxP for semiconductor fabrication.

Agency

Government of Canada → National Research Council of Canada

NAICS

333242 - Semiconductor Machinery Manufacturing View NAICS

Place of Performance

Canada, CAN

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

PostedJun 12

subcontract

Response DeadlineJun 29

Submission deadline

Response Deadline

06/29/2026, 07:00:00 PM UTCin 16 days

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Organization & Contact Information

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AgencyGovernment of Canada → National Research Council of Canada

ContactsNo contacts available

OfficeN/A

Organization / Agency

Government of Canada → National Research Council of Canada

Office AddressN/A

ContactsNo contact information available

Full Description

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Supply and delivery of an ICP etch module compatible with the existing KLA/SPTS Omega fxP platform for semiconductor fabrication processes.

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