Integrated Circuit Assembly & Packaging (Specialized)

The contract pertains to the assembly and specialized packaging of integrated circuits for use in space and military applications, requiring high-reliability fabrication processes to meet stringent environmental and performance standards. Work involves transforming fabricated semiconductor devices into fully functional circuits with custom packaging solutions designed to withstand extreme conditions encountered in aerospace and defense systems, including radiation, thermal cycling, and mechanical stress. Performance will occur at a facility in Washington, D.C., with a zip code of 20375, indicating proximity to key defense research infrastructure. This is a subcontract under NAICS code 334418, issued by the Naval Research Laboratory under the Department of Defense, and is not subject to any specific set-aside classifications. The solicitation was posted on July 29, 2026, with a firm deadline for responses on August 13, 2026, at 7:00 PM Eastern Time. Interested parties must be prepared to demonstrate technical capability in advanced microelectronics assembly, quality control protocols for mission-critical applications, and compliance with defense-related security and documentation requirements. The lack of a designated point of contact suggests that further details may be obtained through the SAM.gov portal listing.