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Linear Microcircuit Manufacturing and Supply

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract entails the full lifecycle manufacturing of 15 units of OP11BY/883C military-grade linear microcircuits, encompassing every stage from wafer fabrication through packaging, electrical testing, and final delivery. All components must meet stringent military specifications, with rigorous traceability documentation required to ensure compliance, quality, and accountability throughout production. The work must be performed to exacting standards suitable for defense applications, where reliability under extreme conditions is critical. The solicitation is designated as a subcontract under NAICS code 334413, issued by the Active Devices Division of the Department of Defense. Responses are due by August 13, 2026, following a posting date of August 2, 2026. Performance is expected to occur in Columbus, Ohio, with the zip code 43213 identified as the place of performance. While no specific point of contact is listed, the contract is accessible via the DIBBS system for interested parties to review detailed requirements and submission procedures.

General Info

Manufacture 15 military-grade microcircuits to DoD specs, deliver in Columbus, Ohio by 2026.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

334413 - Semiconductor and Related Device ManufacturingView NAICS

Place of Performance

COLUMBUS, OH, 43213, US

Set-Aside

NONE

Documents

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No documents available

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → ACTIVE DEVICES DIVISION
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Office AddressN/A
ContactsNo contact information available

Full Description

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Full lifecycle manufacturing, testing, and delivery of 15 units of OP11BY/883C military-grade linear microcircuits, including wafer fabrication, packaging, electrical testing, and traceability documentation.

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