Market Survey for AN/AAS-53A Common Sensor Payload (CSP) spare components

Communications Electronics Command (CECOM)/Integrated Logistics Support Center (ILSC) intends to acquire individual components and spare parts for the AN/AAS-53, Common Sensor Payload (CSP) system, National Stock Number (NSN) 5855-01-641-5099. The original equipment manufacturer (OEM) is Raytheon Company, producer of the Multi -Spectral Targeting System product line of sensors. The current strategy is to initiate a five year, Indefinite Delivery Indefinite Quantity (IDIQ) contract effort. The CSP is a turreted, multi-sensor, Electro-Optic Infrared Sensor with a Laser Designator designed to provide the user with day/night imaging capabilities for reconnaissance, intelligence, surveillance, target acquisition, and target designation. The CSP's capabilities consist of, but are not limited to; operating day or night in all weather and at various altitudes, detecting and recognizing operationally meaningful targets at survivable standoff ranges, providing the location coordinates and auto tracking of designated targets, displaying continuous high resolution imagery, and deliver ordinance within acceptable targeting parameters from a manned or unmanned aerial platform. The government is currently not in possession of releasable drawings in support of this effort. . The purpose of this market survey is to locate sources that have the capability to manufacture and/or supply components of the Common Sensor Payload. A list of CSP Reparable items and their assigned National Stock Number (NSN) are included in Annex A. This market survey is published in accordance with Federal Acquisition (FAR) Part 10, (Market Research). Interested sources, which have technical knowledge of the AN/AAS-53, Common Sensor Payload System, and are capable of furnishing these items, shall send a response describing in detail their ability meeting the government requirements. The response should include your company name, address, cage code, and a technical point of contact. The response SHALL include documentation to demonstrate the interested source's capability of supplying these items, and copy of purchasing order if the supplier was a vendor to the listed source or a statement from the listed source demonstrating that the supplier can, in fact, supply the Army with a unit that will be physically and functionally interchangeable and interoperable with the existing AN/AAS-53 CSP system and existing components/ spares for the AN/AAS-53 Answering this Market Survey The responses to this market survey will be used for informational purposes only. This is not a screening information request or request for proposal of any kind. The US Government is not seeking or accepting unsolicited proposals. The Government will not pay for any information received or costs incurred in preparing the response to the market survey. Therefore any cost associated with the market survey submission is solely at the interested vendor's expense. This market survey is provided to solicit statements of interest and capabilities from industry, including small businesses, service-disabled veteran-owned small businesses and 8(a) certified firms. Information received will be reviewed for form, fit and function. All proprietary and restricted information shall be clearly marked. The response is not to exceed 25 pages in length. Acceptable file formats for the response include Microsoft Word, text, rich text, or Adobe Acrobat. All market survey responses should be emailed to the Technical Point of Contact. No phone inquiries will be accepted, either as a response to this action or for information requests. All requests for information must be emailed to the below address. contact@example.gov Market Survey Questionnaire: Respondents may reply to any or all of the items. Additionally, you may provide supplementary information to support your technical capabilities for manufacturing and supply of military-grade CSP components equal to or better in quality, specification, and functionality of the assemblies/sub-assemblies currently used in the CSP. If you are interested in assisting us with market research information for these items, please answer the below market survey questionnaire. Please complete the following questions. If a question does not apply, please enter non-applicable or N/A. 1) Provide a brief summary of the company and its core competencies. 2) Please provide the following Point of Contact information on all responses: a. Company Name: b. Address: c. Point of Contact: d. Phone Number: e. Fax Numbers: f. Email Address: g. CAGE Code: h. DUNS Number: i. Date of incorporation j. Website address * Please note that respondents shall designate a single point of contact for receipt of all information pursuant to this market survey. 3) Has your Company performed manufacturing and/or supplying thermal imaging components or similar type effort in the past, if so provide Contract Number, Point of Contact (POC), e-mail address, phone number, and a brief description of your direct support of the effort? 4) Describe the qualifications of your engineering staff that have experience in the design and production of thermal imaging components similar in complexity and technology to what is used in the Common Sensor Payload (CSP) system. 5) Describe your company's experience and identify the test equipment used for testing circuit card assemblies and thermal imaging components similar in complexity and technology to what is used in Common Sensor Payload (CSP) equipment. 6) Describe your company's experience in developing or updating a Technical Data Package. 7) Describe your company's experience in managing obsolescence issues. 8) Does your company maintain a Program and Assessment Tool to monitor and analyze the availability of components to allow clear and precise tracking of all obsolescence issues? If so, please elaborate on the Program and Assessment tool(s). 9) Describe your company's experience in identifying the alternatives for the unavailability of obsolete materials or components to mitigate obsolescence issues. 10) Describe your company's experience in re-designing an existing hardware component from a technical data package to meet specified Form, Fit and Function requirements. 11) Describe your company's experience in performing and completing First Article Testing (FAT) requirements for thermal imaging components similar in complexity to what is used in Common Sensor Payload (CSP) systems within a specified timeframe. 12) Discuss your company's capability in meeting US Government contracting delivery requirements. Body of White Paper The submittal should address the requests for information above, and any additional technical or company information. A description of the system supported by technical parameters is desired. The Government requests that interested sources submit an electronic response of not more than twenty-five (25) pages, 8.5" x 11" paper, 12-point Times New Roman font, with a minimum of one (1) inch margins all around. Responses to Small Business questions 5-12 are in addition to the above stated twenty-five (25) page limitation. Responses should include the company name, CAGE Code, point of contact, and address. Supporting documentation (such as marketing brochures, fliers, published presentations or papers and other materials that summarize the technology and more about your company) is acceptable (up to 2 pages worth), and may be referenced by reviewers only in support of claims identified in the White Paper, and only where specifically referenced in the White Paper. The Government makes no guarantee that the supporting documentation will be reviewed and/or considered. Any company proprietary information, performance capabilities and/or future modification plans should be clearly identified and MUST be marked accordingly and will be protected by the Government. - Responses to the Market Survey will not be returned. - Responses to the Market Survey may be used to develop Government documentation. All information marked as proprietary information will be safeguarded to prevent disclosures to non-government personnel and entities. Your interest in this response is appreciated. All interested companies or organizations are encouraged to respond to the Market Survey by providing information by 4 November 2016