This Government Contract opportunity from Department Of Defense was posted on July 1, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
MEMS-Based Vacuum System Design and Integration
Contract Overview
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The contract seeks the design and integration of microelectromechanical systems tailored for compact ultra-high vacuum packages with a volume under five milliliters, targeting a pressure below 10⁻¹⁰ mbar. This effort requires advanced microfabrication techniques and precision hermetic sealing methods to ensure long-term vacuum integrity and stability under demanding operational conditions. The solution must be scalable, robust, and capable of integration into systems requiring extreme vacuum environments, with a focus on miniaturization without compromising performance or reliability. This is a subcontract opportunity posted by the Defense Advanced Research Projects Agency under the Department of Defense, classified under NAICS code 334516 for other semiconductor and related device manufacturing. Proposals must be submitted by July 8, 2026, at 4:00 PM Eastern Time, with the solicitation available through the SAM.gov portal. Performance location details are unspecified, but the technical requirements demand expertise in vacuum packaging, MEMS fabrication, and high-reliability sealing technologies, making this a high-precision, mission-critical project for defense and advanced sensing applications.
General Info
Agency
NAICS
Place of Performance
VASet-Aside
Documents
This scope was carved out of DARPA-SN-26-99.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
Perrseus Proposers Day
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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