This Solicitation opportunity from Montana was posted on January 5, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Montana Microfabrication Facility Chip Bonding Tool

Closed

MSU-IFB-2026-0784State & Local

Submission Closed01/16/2026, 12:00:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334413

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AI Contract Overview

Montana State University is soliciting bids for the purchase of a chip bonding tool intended for the Montana Microfabrication Facility. This equipment will be used to assemble and package photonic integrated circuits (PICs) and related devices, supporting advancements in microfabrication technology. The solicitation is identified as MSU-IFB-2026-0784 and was posted on January 5, 2026, with a response deadline of January 16, 2026. The solicitation falls under the NAICS code 334413, which pertains to semiconductor machinery manufacturing, and is targeted at suppliers capable of providing specialized chip bonding solutions. The place of performance for the contract is Bozeman, Montana. Interested parties can contact Mary Hardin, the primary point of contact, via email for more information. The procurement is managed through the State of Montana’s bidding portal.

General Info

Montana State University seeks bids for chip bonding tool for photonic circuit assembly, deadline January 16.

Agency

Montana State University

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

Bozeman, MT, USA

Set-Aside

NONE

Documents

MSU-IFB-2026-0784 Montana Microfabrication Facility Chip Bonding Tool

ifb

High

AI Contract Breakdown

Uniform Contract Format

Timeline

PhaseClosed

PostedJan 5

Solicitation

Response DeadlineJan 16

Deadline has passed

Submission Closed

01/16/2026, 12:00:00 AM UTC

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Organization & Contact Information

AgencyMontana State University

Contacts1 person available

OfficeN/A

Organization / AgencyMontana State University

Office AddressN/A

Contacts

Mary Hardin

contact@example.gov

Full Description

The Montana Microfabrication Facility is purchasing a tool for chip bonding to assemble and package photonic integrated circuits (PICs) and related devices.