Packaging Support Engineer

This contract involves providing packaging support engineering services at NASA's Goddard Space Flight Center, specifically focusing on tasks such as wire bonding, wafer dicing, flip chip bonding, and assembly for flight hardware and research projects. The work is to be performed at NASA GSFC laboratories within Buildings 11 and 30 over a fixed period from October 1, 2025, through December 31, 2026. The procurement is classified under NAICS code 541611, which covers management, scientific, and technical consulting services, indicating a specialized engineering support role. NASA intends to award this contract on a sole-source basis to Teltrium, Inc., asserting that they are the only provider capable of fulfilling the technical requirements, particularly the need for personnel familiar with NASA GSFC processes to avoid lengthy training delays. The scope emphasizes the importance of personnel with prior experience in NASA GSFC's equipment and procedures, especially for high-precision activities critical to mission success, such as hybridization for the PRIMA/FIRESS instrument. The contract incorporates simplified acquisition procedures under FAR 52.213-4 and includes NASA-specific clauses like the Ombudsman provision. While detailed instructions on packaging, marking, and inspection are not provided, the work must adhere to NASA standards and safety protocols. The solicitation requests capable organizations to submit written capabilities and qualifications by December 4, 2025, with no formal evaluation factors or competitive process outlined, reflecting the sole-source nature of the procurement. The contract also incorporates provisions related to AI system disclosures, emphasizing compliance with OMB M-25-22, and mandates that all work be performed exclusively at NASA GSFC facilities under government oversight.