This Government Contract opportunity from Department Of Energy was posted on July 20, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
PCB Fabrication and Assembly
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
This contract seeks a small business subcontractor to provide turnkey manufacturing of printed circuit boards, encompassing full-cycle services from component procurement through final labeling. The work must adhere strictly to IPC standards for fabrication, surface mount technology assembly, soldering, cleaning, and conformal coating, ensuring high reliability and quality across all production stages. The scope is comprehensive, requiring the vendor to manage all materials, processes, and inspections without reliance on external parties for core manufacturing functions. The opportunity is designated as a Total Small Business Set-Aside under SBA regulations, restricted exclusively to small businesses as defined by the NAICS code 334419. It is issued by Berkeley National Laboratory, a Department of Energy contractor, with performance expected to take place in Berkeley. The solicitations was posted on July 20, 2026, and responses are due by July 31, 2026, at 10:00 PM Eastern Time. All qualified applicants must demonstrate proven capability in end-to-end PCB manufacturing with documented compliance to industry standards and the ability to meet stringent government contracting requirements.
General Info
Agency
NAICS
Place of Performance
Berkeley, CA, USASet-Aside
Documents
This scope was carved out of AA-2026-08.
The full solicitation package (11 documents), including the RFP, is on the prime solicitation, not on this scope.
Beam Position Monitor (BPM) Major Assembly - Group B, C and D
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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