This Government Contract opportunity from Department Of Defense was posted on May 6, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Printed Circuit Board (PCB) Fabrication
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
The contract awards the fabrication of printed circuit board substrates involving critical manufacturing processes such as etching, layering, drilling, and plating to support the production of circuit card assemblies. The work is categorized under NAICS code 334418, specifying electronics manufacturing services, and is structured as a subcontract under the Department of Defense’s SPRMM1 DLA Mechanicsburg procurement. The place of performance is assigned to a location with zip code 74074, indicating the physical site where manufacturing operations must occur. Although the solicitation number and point of contact details are not provided, the response deadline is set for April 13, 2026, at 8:30 PM, and the opportunity was posted on May 6, 2026, suggesting a future bidding window with a reversed chronology that implies a possible data entry error, as the deadline precedes the posting date. The contract does not specify a set-aside type or organization classification, leaving the eligibility criteria open to conventional commercial suppliers capable of meeting defense-grade PCB fabrication standards.
General Info
Agency
NAICS
Place of Performance
OK, 74074, USASet-Aside
Documents
This scope was carved out of SPRMM1-26-Q-HC25.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Amendment - DLA Weapons Support - 5998-016852499 - Circuit Card Ass
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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