This Government Contract opportunity from Department Of Defense was posted on April 22, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Printed Circuit Board (PCB) Fabrication and Assembly
Contract Overview
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AI Contract Overview
This contract involves the full manufacturing, fabrication, and assembly of printed circuit boards (PCBs) in accordance with military specifications, ensuring stringent quality control and electrostatic discharge (ESD)-safe production processes. It is issued as a subcontract by the Department of Defense through SPRMM1 DLA Mechanicsburg, under the NAICS code 334412, which pertains to electronic component manufacturing. The contract focuses on delivering fully compliant and reliable PCBs suited for military applications, requiring adherence to detailed fabrication standards. The solicitation was posted on April 22, 2026, with a response deadline set for May 22, 2026. While specific details such as the solicitation number, place of performance, and contact points are not provided, the contract clearly emphasizes the importance of quality, safety, and compliance with military requirements in producing the PCBs. The work will support the Department of Defense’s needs for high-reliability electronic components, leveraging subcontracting arrangements to fulfill these technical and operational criteria.
General Info
Place of Performance
PA, USASet-Aside
Documents
This scope was carved out of SPRMM126QKE28.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
PRINTED CIRCUIT BOA
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
More opportunities from Department Of Defense → SPRMM1 DLA Mechanicsburg
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