This Government Contract opportunity from Department Of Defense was posted on April 24, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Printed Wiring Board Manufacturing and Assembly
Contract Overview
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AI Contract Overview
The contract calls for the manufacture and delivery of two printed wiring boards identified by NSN 5998-01-324-3211, encompassing full production, rigorous quality assurance testing, and compliance with all applicable military packaging and labeling standards. The work must be performed in accordance with federal defense procurement requirements, ensuring each unit meets exacting technical specifications for performance, durability, and interoperability within military systems. Delivery timelines are tied to the response deadline of May 9, 2026, following a solicitation posted on April 24, 2026, with the contract structured as a subcontract under the NAICS code 334412 for Printed Circuit Board Manufacturing. The contracting authority is the Active Devices Division within the Department of Defense, and the place of performance is not specified beyond the requirement for adherence to military-grade processes. Although the location and point of contact details are unavailable, the contract is accessible through the DIBBS platform with the solicitation number SPE7M526Q0459. All submissions must comply with defense industry protocols for documentation and inspection, and suppliers are expected to demonstrate proven capability in high-reliability electronics manufacturing to qualify for award. No set-aside provisions are indicated, making this opportunity open to all eligible vendors meeting the technical and regulatory criteria.
General Info
Agency
NAICS
Place of Performance
USASet-Aside
Documents
This scope was carved out of SPE7M5-26-Q-0459.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
PRINTED WIRING BOAR
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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