This Government Contract opportunity from Department Of Defense was posted on August 18, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies

Closed

W52P1J26R0001Federal

Submission Closed09/16/2026, 10:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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AI Contract Overview

The Department of the Army, through the DEVCOM Aviation and Missile Center at Redstone Arsenal, is conducting market research via Request for Information W52P1J26R0001 to identify domestic suppliers, designers, and manufacturers of advanced protection architectures and technologies for packaged microelectronics. This initiative focuses on securing components intended for deployment in current and future Department of Defense military systems. The agency is specifically seeking information on seven key technology areas: board-level security within modular open systems architectures, specialized packaging for multi-chip modules and systems-in-package, portable soft IP for enhanced secure boot applications, purpose-designed secure components such as chiplets and ASICs, advanced multi-chip packaging techniques, novel emerging materials and processes, and other compatible security-enabling methods. Under NAICS code 541715, the RFI requests comprehensive vendor responses including technical descriptions, manufacturing compatibility, capability statements, data and intellectual property rights, and preliminary cost and schedule information. This effort is designed to identify suitable vendor teams capable of providing enhanced trust and security for microelectronic components. Interested parties must submit their responses by September 16, 2026, with all inquiries directed to the primary point of contact, Christopher Maurer, through the PIEE system.

General Info

Army seeks domestic suppliers for secure advanced microelectronics packaging and protection technologies.

Agency

Department Of Defense → Department Of The Army

NAICS

541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)

Place of Performance

USA

Set-Aside

NONE

Documents

W52P1J26R0001 RFI – Secure Packaged Microelectronic Components

rfi

High

AI Contract Breakdown

Uniform Contract Format

Timeline

1 update

PhaseClosed

PostedAug 17

special-notice

Notice updatedAug 18

The notice description changed.

Response DeadlineSep 16

Deadline has passed

Submission Closed

09/16/2026, 10:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → Department Of The Army

Contacts1 person available

OfficeN/A

Organization / AgencyDepartment Of Defense → Department Of The Army

Office AddressN/A

Contacts

Christopher Maurer

contact@example.gov

+1 (555) 000-0000

Full Description

Information Requested: The U.S. Army Combat Capabilities Development Command Aviation and Missile Center (DEVCOM AvMC), Redstone Arsenal, AL is conducting market research to identify domestic products, suppliers, designers and manufacturers of advanced protection architectures, systems, components, and other technologies for packaged microelectronics intended for deployment into current and future military systems of interest to the Department of Defense (DoD). This RFI is seeking information from suitable vendors/vendor teams related to the following Technology Areas:

1. Board-level Security: Capabilities spanning microelectronic components and portable soft IP integrated with commercial-off-the-shelf (COTS) devices across modular open systems architectures (MOSA) form factor systems (e.g., 3U/6U OpenVPX/SOSA, 3U/6U SpaceVPX, VNX, and smaller).

2. Package Security: Specialized microelectronics packaging configurations or designs for multi-chip modules (MCMs) or systems-in-package (SIPs) which utilize COTS or bespoke security components that are intended to provide additional security to underlying components.

3. Enhanced Secure Boot: Portable soft IP that can be used in conjunction with COTS microelectronic components to provide additional security for enhanced secure boot applications.

4. Secure Components: Purpose-designed microelectronic components (chiplets, ASICs, etc.) that are intended to provide enhanced trust/security for co-packaged microelectronic components.

5. Multi-chip Packaging: Advanced microelectronics packaging techniques that inherently provide additional component security or could be easily adapted to provide additional microelectronic component security.

6. Emerging Technologies: Novel techniques, materials, and processes that are compatible with modern microelectronic manufacturing/packaging methods that can provide additional security to packaged microelectronic components.

7. Other: Technologies, methods, and processes not mentioned above that are compatible with modern microelectronics design, manufacturing, and packaging techniques and able to provide enhanced security to packaged microelectronic components.

For additional details refer to the Attachment, R2.0_SS_RFI_SUBMISSION_v1.2.