This Solicitation opportunity from Department Of Defense was posted on July 16, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
SEMICONDUCTOR DEVIC
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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The contract pertains to the procurement of a semiconductor device, specifically a diode identified by part number JANTX1N4550RB, governed by military specifications MIL-PRF-19500/358G and MIL-PRF-19500R, both effective through 2026. The item is classified under Federal Supply Class 5961 and must be sourced from qualified manufacturers listed on the DLA Qualified Manufacturers List and qualified suppliers listed on the Qualified Suppliers List of Distributors and Qualified Testing Suppliers List. Strict traceability requirements apply under DLA Procurement Note C03, mandating contractor retention of supply chain documentation. Packaging must comply with MIL-STD-2073-1E and MIL-STD-129, including special ESD-sensitive marking and lead finish identification per IPC/JEDEC J-STD-609, with markings applied to each unit pack. ESD and EMI protection is mandatory using approved materials from qualified manufacturers listed on QPL-81705, specifically Type I and Type III barrier materials as defined by MIL-PRF-81705. The device must be delivered in full compliance with DLA packaging directives, including adequate cushioning to prevent lead damage, with delivery FOB origin within 370 days of contract award. The quantity is 46 units, at a unit price of $46.00, for a total of $2,116.00, with zero variance allowed in quantity. Inspection and acceptance occur at destination, and all items must be shipped to the DLA Distribution facility in New Cumberland, Pennsylvania, under the specified parcel post and freight addresses. The solicitation is a total small business set-aside under NAICS code 334413, with proposals due by July 27, 2026, and the original delivery required by October 14, 2026.
General Info
Agency
NAICS
Place of Performance
2083 NORMANDY DRIVE DOOR 113 TO 134, NEW CUMBERLAND, PA, 17070-5002, USASet-Aside
Timeline
Submission Closed
Organization & Contact Information
Full Description
SEMICONDUCTOR DEVICE, DIODE
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ007: QUALIFIED MANUFACTURERS LIST (QML) INTEGRATED CIRCUITS, HYBRID
MICROCIRCUITS, AND SEMICONDUCTOR DEVICES DLA MARITIME
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL INDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
FULL AND OPEN COMPETITION APPLIES.
TDP Rev A Gen 1 IAW BASIC SPEC NR MIL-PRF-19500/358G(3) REVISION NR G DTD 05/29/2026 PART PIECE NUMBER: JANTX1N4550RB
TDP Rev A Gen 1 IAW REFERENCE SPEC NR MIL-PRF-19500R(1) REVISION NR R DTD 06/02/2026 PART PIECE NUMBER: JANTX1N4550RB
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
SPE7M5-26-T-331Q
SECTION B
PR: 7017528252 PRLI: 0001 CONT’D
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7017528252 0001 EA 46.000
NSN/MATERIAL:5961011872071
DELIVERY (IN DAYS):0370
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:GX CLNG/DRY:1 PRESV MAT:00
WRAP MAT:00 CUSH/DUNN MAT:NB CUSH/DUNN THKNESS:A
UNIT CONT:B9 OPI:M
INTRMDTE CONT:E5 INTRMDTE CONT QTY:100
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
ZZ -ADDITIONAL SPECIAL MARKING: 39 ESD SENSITIVE ELECTRONIC DEVICE REQUIREMENTS OF MIL-STD-129 APPLY.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association
SPE7M5-26-T-331Q
SECTION B
PR: 7017528252 PRLI: 0001 CONT’D
(JEDEC), http://www.jedec.org. http://www.jedec.org.
ESD and PHYSICAL protection are required for contacts, leads, terminals, and other protrusions by means of container design, cushioning, and/or other ESD protective devices. Components with pins or leads shall have adequate cushioning to PREVENT DAMAGE, BREAKAGE and/or BENDING OF LEADS when not specified in the packaging codes.
This item requires DOD QUALIFIED Electrostatic Discharge (ESD) and/or Electromagnetic Interference (EMI) protective packaging materials in accordance with MIL-PRF-81705. All items subject to degradation from ESD/EMI environmental field forces shall be handled and packaged at an approved field force protective work station.
For ESD protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used along with MIL-PRF-81705, Type III (MIL-DTL-117 Type II, Class H, Style 2) barrier material wrap if the contract doesn't specifically require ESD approved cushioning.
For EMI protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used.
The supplier shall be responsible for verifying that all MIL-PRF-81705 barrier materials (or converted bags) were supplied from a qualified manufacturer currently listed on QPL-81705.
For additional ESD/EMI packaging information, refer to the following DLA packaging website: https://www.dla.mil/HQ/LogisticsOperations/Packaging/PackFAQs/ESDS/
If the preservation method code in the solicitation does not specify ESD/EMI protection and the Offeror's proposed item of supply is subject to degradation from ESD/EMI environmental field forces, Offerors shall provide appropriate technical packaging data with their proposals.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
PARCEL POST ADDRESS:
W25G1U
W1A8 DLA DISTRIBUTION
DDSP NEW CUMBERLAND FACILITY
2083 NORMANDY DRIVE DOOR 113 TO 134
NEW CUMBERLAND PA 17070-5002
US
FOR TRANSPORTATION SEE DLAD DLAD PROC NOTE C19. FOR FIRST DESTINATION TRANSPORTATION SEE DLAD PROC NOTE
C20 AND CONTRACT
FREIGHT SHIPPING ADDRESS:
W25G1U
W1A8 DLA DISTRIBUTION
DDSP NEW CUMBERLAND FACILITY
2083 NORMANDY DRIVE DOOR 113 TO 134
NEW CUMBERLAND PA 17070-5002
US
SPE7M5-26-T-331Q
SECTION B
PR: 7017528252 PRLI: 0001 CONT’D
Need Ship Date:08/02/2027 Original Required Delivery Date:10/14/2026
SPE7M5-26-T-331Q NSN/Part Number: 5961-01-187-2071 Quantity: 46 EA Purchase Request: 7017528252QTY: 46 Delivery: 370 days ADO
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