This Solicitation opportunity from Department Of Defense was posted on June 9, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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SEMICONDUCTOR DEVIC

Closed

SPE7M5-26-T-245EFederal

Submission Closed06/22/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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AI Contract Overview

This solicitation, issued by the Department of Defense Active Devices Division under number SPE7M5-26-T-245E, is for the procurement of 1,471 units of semiconductor devices, specifically NSN 5961-01-725-0141, manufactured by Dynalec Corporation (Part Number 16129024). The contract specifies a delivery timeline of 190 days with a required delivery date of December 30, 2026, to the DLA Distribution New Cumberland facility. Terms include FOB Origin with inspection and acceptance occurring at the destination. Surplus items are explicitly deemed unacceptable for this requirement. The contract mandates strict adherence to technical and quality requirements, including supply chain traceability documentation and qualification via the Qualified Suppliers List of Distributors (QSLD) and Qualified Testing Suppliers List (QTSL) for Federal Supply Classes 5961 and 5962. Rigorous packaging standards are required to prevent electrostatic discharge (ESD) and electromagnetic interference (EMI) in accordance with MIL-PRF-81705 and MIL-STD-129. Additionally, the contractor must apply lead finish markings on individual unit packs as per IPC/JEDEC J-STD-609 standards to identify lead or lead-free attributes.

General Info

DoD procurement of 1,471 Dynalec semiconductor devices due December 30, 2026.

Agency

Department Of Defense → ACTIVE DEVICES DIVISION

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

2083 NORMANDY DRIVE DOOR 113 TO 134, NEW CUMBERLAND, PA, 17070-5002, USA

Set-Aside

NONE

Documents

Request for Quotations SPE7M5-26-T-245E

rfq

High

AI Contract Breakdown

Uniform Contract Format

Contract not broken down yet

CLEATUS splits the solicitation into Uniform Contract Format (UCF) sections: scope, pricing, deliverables, and evaluation criteria.

Timeline

PhaseClosed

PostedJun 9

Solicitation

Response DeadlineJun 22

Deadline has passed

Submission Closed

06/22/2026, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

Contacts1 person available

OfficeUSA

Organization / AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

Office AddressUSA

Contacts

Jacob Mokma

contact@example.gov

+1 (555) 000-0000

Full Description

SEMICONDUCTOR DEVIC
SEMICONDUCTOR DEVIC
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL INDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC MICROCIRCUITS
SPE7M5-26-T-245E
SECTION B
The Government Procuring Activity has determined that Surplus is not Acceptable for this NSN. (End of TQ Requirement)
RD003, COVERED DEFENSE INFORMATION POTENTIALLY APPLIES
DYNALEC CORPORATION 12763 P/N 16129024
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7016707002 0001 EA 1,471.000
NSN/MATERIAL:5961017250141
DELIVERY (IN DAYS):0190
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:GX CLNG/DRY:1 PRESV MAT:00
WRAP MAT:00 CUSH/DUNN MAT:LT CUSH/DUNN THKNESS:A
UNIT CONT:D3 OPI:M
INTRMDTE CONT:E5 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:39 -39 ESD sensitiv electrnic dvce
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
ESD and PHYSICAL protection are required for contacts, leads, terminals, and other protrusions by means of container design, cushioning, and/or other ESD protective devices. Components with pins or leads shall have adequate cushioning to PREVENT DAMAGE, BREAKAGE and/or BENDING OF LEADS when not specified in the packaging codes.
This item requires DOD QUALIFIED Electrostatic Discharge (ESD) and/or Electromagnetic Interference (EMI) protective packaging materials in accordance with MIL-PRF-81705. All items subject to degradation from ESD/EMI environmental field forces shall be handled and packaged at an approved field force protective work station.
For ESD protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used along with MIL-PRF-81705, Type III (MIL-DTL-117 Type II, Class H, Style 2) barrier material wrap if the contract doesn't specifically require ESD approved cushioning.
SPE7M5-26-T-245E
SECTION B
PR: 7016707002 PRLI: 0001 CONT’D
For EMI protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used.
The supplier shall be responsible for verifying that all MIL-PRF-81705 barrier materials (or converted bags) were supplied from a qualified manufacturer currently listed on QPL-81705.
For additional ESD/EMI packaging information, refer to the following DLA packaging website: https://www.dla.mil/HQ/LogisticsOperations/Packaging/PackFAQs/ESDS/
If the preservation method code in the solicitation does not specify ESD/EMI protection and the Offeror's proposed item of supply is subject to degradation from ESD/EMI environmental field forces, Offerors shall provide appropriate technical packaging data with their proposals. UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
PARCEL POST ADDRESS:
W25G1U
W1A8 DLA DISTRIBUTION
DDSP NEW CUMBERLAND FACILITY
2083 NORMANDY DRIVE DOOR 113 TO 134
NEW CUMBERLAND PA 17070-5002
US
FOR TRANSPORTATION SEE DLAD DLAD PROC NOTE C19. FOR FIRST DESTINATION TRANSPORTATION SEE DLAD PROC NOTE
C20 AND CONTRACT
FREIGHT SHIPPING ADDRESS:
W25G1U
W1A8 DLA DISTRIBUTION
DDSP NEW CUMBERLAND FACILITY
2083 NORMANDY DRIVE DOOR 113 TO 134
NEW CUMBERLAND PA 17070-5002
US
Need Ship Date:12/30/2026 Original Required Delivery Date:12/30/2026
SPE7M5-26-T-245E NSN/Part Number: 5961-01-725-0141 Quantity: 1,471 EA Purchase Request: 7016707002QTY: 1471 Delivery: 190 days ADO