This Solicitation opportunity from Department Of Defense was posted on October 1, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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SEMICONDUCTOR DEVICE, D

Closed

SPE7M5-26-T-514XFederal

Submission Closed10/06/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334413

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Supplier of Semiconductor Device, Diode (NSN 5961-01-026-2577)This subcontract, issued by the Department of Defense DLA Weapons Support Active Devices Division, requires the supply of two semiconductor diode units under NSN 5961-01-026-2577. The hardware must be delivered to Tobyhanna, Pennsylvania, and the supplier is required to hold qualifications for FSC 5961 and 5962. Strict adherence to military standards is mandatory, including packaging per MIL-STD-2073-1E and MIL-DTL-19491, and marking per MIL-STD-129 and IPC/JEDEC J-STD-609. Additionally, the provider must maintain full supply chain traceability in accordance with DLAD Procurement Note C03. The response deadline for this requirement is November 9, 2026.

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Supply of Fixed Wire Wound Resistors (NSN 5905-01-063-8462)This subcontract involves the supply of 5,000 fixed wire wound resistors for prime contractors supporting DLA supply contracts. The components must be manufactured or sourced to meet NSN 5905-01-063-8462 specifications. All items require strict adherence to marking standards MIL-STD-129 and IPC/JEDEC J-STD-609, with packaging performed according to MIL-STD-2073-1E and RP001. The contract is managed by the Department of Defense under the DLA Weapons Support Active Devices Division, with performance taking place at Hill AFB. Compliance with the Buy American Act and DFARS 252.204-7012 is mandatory. The response deadline for this requirement is November 9, 2026.

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POSTED

1 day ago

DEADLINE

in 11 days

AI Contract Overview

Solicitation SPE7M5-26-T-514X is a fixed-price request for quotation issued by the DLA Land and Maritime Active Devices Division for the procurement of one semiconductor diode, identified by NSN 5961-00-146-9449. The requirement specifies a delivery lead time of five days after order, with an original required delivery date of September 17, 2026. Delivery is FOB Origin, and inspection and acceptance will occur at the destination, specifically the AF Supply Control Receiving facility at Robins AFB, Georgia. The contract mandates strict adherence to technical and quality requirements, including supply chain traceability documentation and compliance with the Qualified Suppliers List of Distributors and Qualified Testing Suppliers List for Federal Supply Class 5961. Packaging and marking must comply with MIL-STD-2073-1E, MIL-STD-129, and MIL-DTL-19491, with specific lead finish markings required per IPC/JEDEC J-STD-609. All quotes must be submitted via the DIBBS system, and the use of additive manufacturing is prohibited unless specifically authorized. Payment and invoicing are to be processed through the Wide Area WorkFlow system.

General Info

Fixed-price RFQ for one semiconductor diode delivered to Robins AFB by September 2026.

Agency

Department Of Defense → ACTIVE DEVICES DIVISION

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

455 BYRON ST BLDG 376, ROBINS AFB, GA, 31098-1626, USA

Set-Aside

NONE

Documents

SPE7M5-26-T-514X Request for Quotations

rfq

High

AI Contract Breakdown

Uniform Contract Format

Timeline

1 update

PhaseClosed

PostedSep 21

Solicitation

Deadline changedOct 1

Response deadline changed from Oct 1, 2026 to Oct 6, 2026.

Response DeadlineOct 6

Deadline has passed

Submission Closed

10/06/2026, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

Contacts1 person available

OfficeUSA

Organization / AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

Office AddressUSA

Contacts

Margaret Smith

contact@example.gov

+1 (555) 000-0000

Full Description

SEMICONDUCTOR DEVICE,DIODE
SEMICONDUCTOR DEVICE, DIODE
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ014: QUALIFIED SUPPLIERS LIST OF DISTRIBUTORS (QSLD) AND QUALIFIED
TESTING SUPPLIERS LIST (QTSL) FOR FEDERAL SUPPLY CLASS (FSC) 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS. THIS IS A QUALIFIED ITEM. QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE M01 "QUALIFIED SUPPLIERS FOR FEDERAL SUPPLY CLASS (FSC)
5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS" APPLY.
RQ017: PHYSICAL IDENTIFICATION/BARE ITEM MARKING
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ018: CONTRACTOR RETENTION OF SUPPLY CHAIN TRACEABILITY DOCUMENTATION
(AUG 2016)
This item requires supply chain traceability documentation in accordance with DLA Directive (DLAD) Procurement Notes #C03 Contractor Retention of Supply Chain Traceability Documentation (AUG 2016)#. The full text of C03 can be found in the DLAD Procurement Notes on the Web at: http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx. (End of TQ Requirement)
REV K DTD 16 JAN 86 AND POSESS THE DEGREE OF INTERCHANGEABILITY DEFINED IN MIL-STD-280A<(>,<)> PARA. 3.2.1. UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961 SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
SPE7M5-26-T-514X
SECTION B
MICROCIRCUITS
The Government Procuring Activity has determined that Surplus is not Acceptable for this NSN. (End of TQ Requirement)
RD003, COVERED DEFENSE INFORMATION POTENTIALLY APPLIES
BAE SYSTEMS INFORMATION AND ELECTRONIC 94117 P/N 196040P160
MICRO USPD INC 12969 P/N UZ7780
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7018395608 0001 EA 1.000
NSN/MATERIAL:5961001469449
DELIVERY (IN DAYS):0005
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:ZZ CLNG/DRY:1 PRESV MAT:ZZ
WRAP MAT:ZZ CUSH/DUNN MAT:ZZ CUSH/DUNN THKNESS:C
UNIT CONT:ZZ OPI:M
INTRMDTE CONT:ZZ INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
PRESERVATION AND PACKAGING SHALL BE IAW THE
LATEST REVISION OF MILITARY SPECIFICATION:
MIL-DTL-19491, FOR SEMICONDUCTOR DEVICES.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association
SPE7M5-26-T-514X
SECTION B
PR: 7018395608 PRLI: 0001 CONT’D
Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS
PARCEL POST ADDRESS:
FB2065
FB2065 AF SUPPLY CNTRL RECV
CP +1 (555) 000-0000
455 BYRON ST BLDG 376
ROBINS AFB GA 31098-1626
US
RDD 777 SHIPMENT. SHIP BY FASTEST TRACEABLE MEANS. DO NOT USE PARCEL POST.
FREIGHT SHIPPING ADDRESS:
FB2065
FB2065 AF SUPPLY CNTRL RECV
CP +1 (555) 000-0000
455 BYRON ST BLDG 376
ROBINS AFB GA 31098
US
M/F: (TCN) FB206562570998
RDD: 777
PROJ: AWP TP 1
SUPP ADD: SIG: A
FOR GOVERNMENT USE ONLY: (IPD) 03
DIC: A0A DIST: 0A ADV: 6N FC: 6C
Need Ship Date:00/00/0000 Original Required Delivery Date:09/17/2026
SPE7M5-26-T-514X NSN/Part Number: 5961-00-146-9449 Quantity: 1 EA Purchase Request: 7018395608QTY: 1 Delivery: 5 days ADO