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This Government Contract opportunity from Department Of Defense was posted on July 5, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Semiconductor Device Supply & Assembly

Closed
Federal

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The contract pertains to the procurement and final assembly of a specified semiconductor device set that must meet stringent military packaging and handling standards. This subcontract is issued under the Department of Defense’s Active Devices Division, with performance required at a designated location in New Cumberland, Pennsylvania, zip code 17070-5002. The work falls under NAICS code 334413, which classifies it within semiconductor and related device manufacturing. The solicitation is set aside for small business concerns as defined by the Small Business Administration, emphasizing support for small business participation in defense-related manufacturing. Interested parties must submit responses by the deadline of July 16, 2026, with the opportunity posted on July 5, 2026. The contract’s scope centers on ensuring the devices are fully compliant with military specifications for durability, environmental resilience, and handling procedures, with final assembly completed to meet operational readiness requirements.

General Info

Small business subcontract for military-grade semiconductor assembly in New Cumberland, PA, due July 16, 2026.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

NEW CUMBERLAND, PA, 17070-5002, USA

Set-Aside

SBA

Documents

This scope was carved out of SPE7M5-26-T-298X.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SEMICONDUCTOR DEVICE S

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Procurement and final assembly of a specified semiconductor device set compliant with military packaging and handling standards.

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