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Semiconductor Wafer Fabrication Services

Active

Grant

Response Deadline12/02/2026, 04:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract for Semiconductor Wafer Fabrication Services supports prime contractors engaged in chip design research projects for the Engineering and Physical Sciences Research Council under UK Research and Innovation. The scope of work involves providing specialized fabrication services within certified cleanroom facilities, specifically focusing on photolithography, etching, doping, and wafer processing. These services are tailored for legacy CMOS chips ranging from 22nm to 90nm on wafers sized between 200mm and 300mm, with final deliverables consisting of physical semiconductor wafers or diced chip prototypes. The opportunity was posted on September 27, 2026, with a response deadline of December 2, 2026. Classified under NAICS code 334413, the contract is designed to facilitate the technical production phase of semiconductor research and development. Interested parties must ensure their capabilities align with the specific legacy node requirements and cleanroom standards necessary to produce the required hardware prototypes.

General Info

Subcontract for legacy CMOS semiconductor wafer fabrication services for UK research chip prototypes.

Agency

UK Research and Innovation → Engineering and Physical Sciences Research Council (EPSRC)

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of 205099.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Doctoral focal award: chip design and verification

AI Contract Breakdown

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Timeline

PostedSep 27

subcontract

Response DeadlineDec 2

Submission deadline

Response Deadline

12/02/2026, 04:00:00 PM UTCin about 1 month

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Organization & Contact Information

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AgencyUK Research and Innovation → Engineering and Physical Sciences Research Council (EPSRC)

ContactsNo contacts available

OfficeN/A

Organization / AgencyUK Research and Innovation → Engineering and Physical Sciences Research Council (EPSRC)

Office AddressN/A

ContactsNo contact information available

Full Description

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Supplies fabrication services for prime contractors on EPSRC chip design research projects. Performs photolithography, etching, doping, and wafer processing for legacy CMOS chips (22nm-90nm on 200mm-300mm wafers) within certified cleanroom facilities. Delivers physical semiconductor wafers or diced chip prototypes.

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