This Government Contract opportunity from Department Of Defense was posted on August 18, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Top

Specialized Microelectronics Packaging (MCM/SiP)

Closed

Federal

Submission Closed09/16/2026, 10:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

Active Opportunities Like This One

NAICS: 334413

New

DIBBS

Supply of Specialized Connectors and WiringThis subcontract involves the supply of raw materials, specialized connectors, shielding, and high-grade wiring to prime contractors supporting the DLA Weapons Support ASC Commodities Division. A primary focus of the agreement is the sourcing of components for Kongsberg part number 60269836-02. To maintain the integrity of these critical applications, the provider must deliver certified electronic components accompanied by Certificates of Conformance. The contract mandates strict adherence to the Buy American Act and DFARS standards for the prevention of counterfeit parts. Operating under NAICS code 334413, the project is managed by the Department of Defense. The solicitation was posted on October 27, 2026, with a response deadline set for November 12, 2026.

DLA WEAPONS SUPPORT ASC COMMODITIES DIVISION

POSTED

DEADLINE

DOD-Qualified ESD/EMI Protective PackagingThis subcontract, managed by the Department of Defense under the DLA Weapons Support Active Devices Division, involves the specialized handling and packaging of critical microcircuits for prime contractors. The work is performed at an approved field force protective work station in Columbus, Ohio, utilizing DOD-qualified ESD/EMI protective materials. All activities must strictly adhere to MIL-PRF-81705 standards to ensure that microcircuits are properly sealed and protected against electrostatic discharge and electromagnetic interference damage. The opportunity is categorized under NAICS code 334413 and was posted on October 27, 2026, with a response deadline of November 9, 2026. The primary objective is the delivery of microcircuits that meet rigorous DOD protective standards to support DLA Land and Maritime supply contracts.

DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

DEADLINE

Supply of Critical Electrical Receptacle ConnectorsThis subcontract, managed by the Active Devices Division of the Department of Defense, involves the procurement or manufacture of critical electrical receptacle connectors. The supplier is responsible for providing parts that match Teledyne Defense Electronics part number 11RC7011 to support prime contractors fulfilling DLA supply contracts. The contractor must ensure all items are marked according to MIL-STD-129 and palletized in accordance with RP001 DLA Packaging Requirements. Additionally, the supplier must maintain full compliance with the Consumer Product Safety Act to ensure the delivery of physical connectors that meet all specified military standards.

ACTIVE DEVICES DIVISION

POSTED

DEADLINE

Supply of Critical Application Lamp AssembliesThis subcontract involves the supply of two high-precision lamp assemblies for prime contractors supporting DLA supply contracts. The required hardware must be AMETEK INC part number 4872W17G710, conforming to TDP Rev A Gen 1 and NSN 6240014795239. Due to the nature of these components as Critical Application Items, strict adherence to quality control standards is mandatory. The contract is issued by the Department of Defense under the DLA Weapons Support ASC Supplier Order OEM Division, with performance taking place in Phoenix, Arizona. Eligible providers must possess a valid UEI and CAGE code. The response deadline for this requirement is November 4, 2026.

DLA WEAPONS SUPPORT ASC SUPPLIER OPER OEM DIVISION

POSTED

DEADLINE

High-Reliability Connector and Wire SupplyThis subcontract for High-Reliability Connector and Wire Supply involves the provision of military-grade connectors and wiring to prime contractors supporting the DLA Weapons Support ASC Commodities Division. The scope of work focuses on delivering raw materials and components specifically for NSN 5995-01-722-1171, ensuring all items meet limited rights data specifications and are delivered directly to the assembly manufacturer. To maintain strict quality and regulatory standards, the supplier must ensure all materials comply with the Buy American Act and provide Certificates of Conformance for full traceability. This Department of Defense requirement falls under NAICS code 334413, with a response deadline set for November 4, 2026.

DLA WEAPONS SUPPORT ASC COMMODITIES DIVISION

POSTED

DEADLINE

Solicitation # SPE7M5-27-T-1562

DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

DEADLINE

Solicitation # SPE7M5-27-T-1071

Solicitation SPE7M5-27-T-1071 is a fixed-price request for quotations issued by the DLA Weapons Support Active Devices Division for 19 units of Linear Microcircuits (NSN 5962-01-394-2132). This procurement is a total small business set-aside under NAICS 334413. The items are designated as critical application items and must be sourced from approved manufacturers listed on the Qualified Products List (QPL) or Qualified Manufacturers List (QML). The need ship date is November 12, 2026, with an original required delivery date of May 28, 2027, delivered FOB Origin to DLA Distribution DDWO in Columbus, Ohio. The contract mandates strict quality and security compliance, including a CMMC Level 2 Self-Assessment and adherence to supply chain traceability documentation per DLAD Procurement Note C03. Contractors must submit DLA Land and Maritime Form 918 and supporting traceability or test reports to the contract administrator at least 15 days prior to the delivery date; shipment is prohibited until written authorization is received. Packaging must meet MIL-STD-2073-1E and MIL-PRF-81705 standards for electrostatic discharge and electromagnetic interference protection, with specific lead finish markings required per IPC/JEDEC J-STD-609. Inspection and acceptance will occur at the destination.

DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

DEADLINE

Solicitation # SPE7M2-27-T-0388

DLA WEAPONS SUPPORT NUCLEAR REACTOR PROGRAM

POSTED

DEADLINE

SEMICONDUCTOR DEVICE, T

Solicitation # SPE7M5-27-T-1597

Solicitation SPE7M5-27-T-1597 is a request for quotations issued by the DLA Weapons Support Active Devices Division for the procurement of three semiconductor device thyristors, identified by NSN 5961-01-115-2436. This is a Foreign Military Sales requirement for Taiwan, with delivery terms set as FOB Origin and a required delivery date of September 2, 2026. The items must adhere to specific technical data, including Teledyne Drawing 6A2027 and MIL-STD-280A for interchangeability, and must undergo gross leak testing per MIL-STD 750. The contract requires strict adherence to supply chain traceability documentation per DLA Directive Procurement Note C03 and mandates that suppliers be listed on the Qualified Suppliers List of Distributors or Qualified Testing Suppliers List for FSC 5961 and 5962. Packaging and marking must comply with MIL-DTL-19491, MIL-STD-129, and IPC/JEDEC J-STD-609 for lead finish identification. Inspection and acceptance will occur at the point of origin. The procurement is subject to various federal regulations, including the Buy American Act, DFARS prohibitions on certain telecommunications equipment, and NIST SP 800-171 cybersecurity standards. Payment and receiving reports must be processed electronically through the Wide Area WorkFlow system. Offers involving additive manufacturing are ineligible for award unless specifically authorized, and the government may apply a price evaluation preference for HUBZone concerns. Quotations are due by November 9, 2026.

DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

DEADLINE

MICROCIRCUIT, DIGITAL

Solicitation # SPE7M1-27-T-1016

Solicitation SPE7M1-27-T-1016, issued by the DLA Weapons Support Maritime Supply Chain, is a request for quotations for 217 units of a digital microcircuit, specifically Linear Technology LLC part number LT1720IMS8 (NSN 5962015955577). The procurement falls under NAICS 334413 and requires delivery to DLA Distribution DDWO in Columbus, Ohio, with a need ship date of February 2, 2027, and a required delivery date of May 1, 2027. Inspection and acceptance will occur at the destination. The contract mandates strict quality and security compliance, including a CMMC Level 2 Self-Assessment and adherence to the Qualified Suppliers List of Distributors (QSLD) and Qualified Testing Suppliers List (QTSL) for Federal Supply Classes 5961 and 5962. Contractors must provide supply chain traceability and test reports via DLA Land and Maritime Form 918 at least 15 days prior to delivery to receive shipping authorization. Packaging must comply with MIL-STD-2073-1E and MIL-STD-129, with specific requirements for ESD and EMI protection using MIL-PRF-81705 materials and lead finish marking per IPC/JEDEC J-STD-609. Payment will be processed electronically through the Wide Area Workflow system.

DLA WEAPONS SUPPORT MARITIME SUPPLY CHAIN

POSTED

DEADLINE

DISPLAY, OPTOELECTRONIC

Solicitation # SPE7M5-27-Q-0117

Solicitation SPE7M5-27-Q-0117 is a firm-fixed-price, small business set-aside request for the procurement of 18 optoelectronic displays, identified by NSN 5980-20-001-5173. Issued by the DLA Weapons Support Active Devices Division, the contract requires delivery within 120 days after the date of order to the DLA Distribution DDSP New Cumberland facility in Pennsylvania. Both inspection and acceptance are designated at the destination. Award will be based on the best value to the government, evaluating price, offered delivery, and past performance. The contractor must adhere to strict technical and quality standards, including MIL-STD-129 for marking and MIL-STD-2073-1E for packaging, as well as DLA packaging requirements RP001. Special restrictions prohibit the intentional addition of mercury or mercury-containing compounds, except for specific functional exceptions. Compliance with DFARS 252.204-7012 regarding the safeguarding of covered defense information and cyber incident reporting is mandatory. Invoicing and payment must be processed electronically through the Wide Area WorkFlow system. Quotations are due by November 11, 2026.

DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

DEADLINE

MICROCIRCUIT, DIGITAL

Solicitation # SPE7M5-27-T-0940

Solicitation SPE7M5-27-T-0940 is a procurement for three digital microcircuits, identified by NSN 5962-01-112-7084 and part number SL10536/BEA from Landsdale Semiconductor, Inc. The contract requires delivery to DLA Distribution DDWO in Columbus, Ohio, with an original required delivery date of February 5, 2027, and a need ship date of April 6, 2027. This is a critical application item that mandates strict adherence to Federal Supply Class 5962 requirements, including the prohibition of surplus materials and the requirement for supply chain traceability documentation. The contractor must comply with rigorous packaging and marking standards, specifically IPC/JEDEC J-STD-609 for lead finish identification and MIL-PRF-81705 for electrostatic discharge and electromagnetic interference protection. Traceability is managed via DLA Land and Maritime Form 918, which must be submitted and approved by the contract administrator prior to shipment. Inspection and acceptance are set at the destination per FAR 52.246-2. Additionally, the award requires a CMMC Level 2 self-assessment and adherence to various DFARS clauses regarding cybersecurity, the Buy American Act, and the prohibition of covered defense telecommunications equipment. Payment will be processed electronically through the Wide Area WorkFlow system.

DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

about 18 hours ago

DEADLINE

in 2 days

AI Contract Overview

This subcontract opportunity with the Department of the Army involves the design and manufacture of specialized packaging configurations for Multi-Chip Modules or Systems-in-Package. Supporting prime contractors on Army DEVCOM AvMC projects, the selected provider will integrate either commercial off-the-shelf or bespoke security components to enhance the protection of underlying microelectronic components. A critical requirement for this effort is compatibility with domestic manufacturing processes to ensure the secure delivery of the final packaged modules. Interested parties should note the response deadline of September 16, 2026, for this project categorized under NAICS code 334413.

General Info

Army subcontract for secure microelectronic packaging design and manufacture by September 16, 2026.

Agency

Department Of Defense → Department Of The Army

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

USA

Set-Aside

NONE

Documents

This scope was carved out of W52P1J26R0001.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies

AI Contract Breakdown

Uniform Contract Format

No documents to break down

The breakdown needs solicitation documents. None were found from this contract's source.

Timeline

PhaseClosed

PostedAug 18

subcontract

Response DeadlineSep 16

Deadline has passed

Submission Closed

09/16/2026, 10:00:00 PM UTC

Find active opportunities like this

Start your free trial to discover similar active contracts, track opportunities, and build proposals with AI assistance.

Organization & Contact Information

AgencyDepartment Of Defense → Department Of The Army

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → Department Of The Army

Office AddressN/A

ContactsNo contact information available

Full Description

Designs and manufactures specialized packaging configurations for Multi-Chip Modules (MCMs) or Systems-in-Package (SiPs) for prime contractors on Army DEVCOM AvMC projects. Utilizes COTS or bespoke security components to provide additional security to underlying microelectronic components. Requires domestic manufacturing compatibility. Delivers securely packaged MCMs or SiPs.