This Government Contract opportunity from Department Of Defense was posted on July 21, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Stamping Die Design and Fabrication – Side A
Contract Overview
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The contract requires the design and fabrication of a precision stamping die for Side A of a PCMCIA-based data card enclosure using government-provided 3D models, with full documentation and associated tooling delivered as part of the scope. The work must be performed by a Service-Disabled Veteran-Owned Small Business, as this is a set-aside opportunity under NAICS code 332439, and the place of performance is listed as Linda, California, with a zip code of 95652. The solicitation was posted on July 21, 2026, and responses are due by July 31, 2026, at 9:00 PM Eastern Time. This is a subcontract under the Defense Microelectronics Activity within the Department of Defense, and all deliverables must meet exacting standards for precision and completeness to ensure compatibility with the government’s existing design and production systems.
General Info
Agency
NAICS
Place of Performance
LINDA, CA, 95652, USASet-Aside
Documents
This scope was carved out of HQ072726QCB04.
The full solicitation package (7 documents), including the RFP, is on the prime solicitation, not on this scope.
Case Manufacturing
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Timeline
Submission Closed
Organization & Contact Information
Full Description
More opportunities from Department Of Defense → Defense Microelectronics Activity
Same awarding agency
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