Ultra-Low Power Semiconductor Chiplet Development

This contract focuses on the development and fabrication of ultra-low power semiconductor chiplets designed for sensing, processing, and power management. These chiplets are intended to be integrated with wet biosensor components, enabling continuous operation over a period exceeding seven days. The work involves creating dry semiconductor-based components that complement the wet biosensor elements, ensuring seamless functionality and durability in their combined application. Issued by the Advanced Research Projects Agency for Health (ARPA-H) under the Department of Health and Human Services, this subcontract targets innovations in semiconductor technology within the NAICS code 334413, which pertains to semiconductor and related device manufacturing. The solicitation was posted on April 1, 2026, with a response deadline set for May 13, 2026. Although specifics about the place of performance or points of contact are not provided, the contract is positioned to advance health-related technology through the integration of cutting-edge semiconductor chiplets with biological sensing capabilities.