This Government Contract opportunity from Department Of Defense was posted on April 27, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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VME Computer Assembly and Manufacturing

Closed

Federal

Submission Closed06/24/2026, 06:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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Specialized PCB Fabrication (NSN 5998016434816)This subcontract involves the fabrication of five Printed Circuit Boards for the DLA Weapons Support Active Devices Division under the Department of Defense. The manufacturer must produce the boards in strict accordance with the technical drawings and material specifications for NSN 5998016434816, with a specific requirement that no mercury be intentionally added during the process. To qualify, the contractor must possess fabrication equipment capable of meeting military-grade specifications and maintain a CMMC Level 2 Self-Assessment. The project is categorized under NAICS code 334412, with performance taking place in New Cumberland, Pennsylvania. The response deadline for this requirement is November 9, 2026.

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Supply of Circuit Card Assemblies (NSN 5998-01-736-8074)This subcontract through the DLA Weapons Support Maritime Supply Chain requires the delivery of 100 Circuit Card Assemblies under NSN 5998-01-736-8074. The contractor is responsible for manufacturing or sourcing these units according to Harting part number 09 14 012 3101 or Federal Equipment Co part number 7A20071. Performance will take place in New Cumberland, Pennsylvania, with a response deadline of November 9, 2026. Strict adherence to quality and regulatory standards is mandatory, including the DLA Master List, MIL-STD-2073-1E, and MIL-STD-129 for packaging. Additionally, the contractor must comply with NAVSEA 5100-003D regarding mercury containment, NIST SP 800-171 for cybersecurity, and the Buy American Act. The final deliverable consists of 100 fully packaged units meeting all specified technical and safety requirements.

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DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

about 21 hours ago

DEADLINE

in 12 days

AI Contract Overview

The contract encompasses full manufacturing, design control, material selection, and part number management for a Circuit Card Assembly (CCA) designated as COMPUTER, VME, MC under CLIN 0001, requiring strict adherence to all applicable military and federal standards. This includes end-to-end responsibility for the production and technical oversight of the assembly, ensuring all components and processes meet rigorous defense-grade specifications for performance, reliability, and traceability. The work is scoped to deliver a fully compliant VME computer system ready for integration into military applications without requiring additional development or modification by the end user. The contract is a subcontract under the Department of Defense, managed by SPRMM1 DLA Mechanicsburg, with performance required to occur in Orlando, Florida, 32825. The solicitation was posted on April 27, 2026, and responses are due by June 24, 2026, at 6:00 PM. The NAICS code 334412 indicates classification under Electronic Component and Product Manufacturing, emphasizing the technical nature of the work. All aspects of the project must align with federal procurement regulations and defense industry best practices, with no set-aside provisions specified, meaning the opportunity is open to all eligible entities.

General Info

Manufacture and design control of VME Computer Assembly for Department of Defense, Orlando.

Agency

Department Of Defense → SPRMM1 DLA Mechanicsburg

NAICS

334412 - Bare Printed Circuit Board Manufacturing

Place of Performance

Orlando, FL, 32825, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRMM1-26-Q-HB94.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

DLA Maritime, NSN-5998-01-705-0456

AI Contract Breakdown

Uniform Contract Format

No documents to break down

The breakdown needs solicitation documents. None were found from this contract's source.

Timeline

PhaseClosed

PostedApr 27

subcontract

Response DeadlineJun 24

Deadline has passed

Submission Closed

06/24/2026, 06:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → SPRMM1 DLA Mechanicsburg

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → SPRMM1 DLA Mechanicsburg

Office AddressN/A

ContactsNo contact information available

Full Description

Full manufacturing, design control, material selection, and part number management for Circuit Card Assembly (CCA), COMPUTER, VME, MC as specified under CLIN 0001, including compliance with military and federal standards.