ADVANCED DICING TECHNOLOGIES INC
ADVANCED DICING TECHNOLOGIES INC is a federal contractor, registered under UEI CW6UN3QFNME7 and CAGE code 39ZM8. It has been awarded $877,281 in federal contracts. Primary work spans Semiconductor and Related Device Manufacturing, Analytical Laboratory Instrument Manufacturing, and Other Industrial Machinery Manufacturing. Top awarding agencies include Department Of Defense, National Aeronautics And Space Administration, and Department Of Commerce.
Contact Information
Registration and classification details
Registration
UEI Code
CW6UN3QFNME7CAGE Code
39ZM8Entity Structure
Corporate Entity (Not Tax Exempt)Established
N/ABusiness Classifications
NAICS Codes
Federal Contracting Overview
Award totals, agency breakdown, NAICS distribution, and geographic footprint.
AI Capability Profile
Advanced Dicing Technologies Inc. specializes in the design, integration, and upgrade of precision semiconductor manufacturing equipment, with a focused expertise in dicing saw systems and ultraviolet curing technologies. The company delivers mission-critical hardware and software solutions for wafe...
Advanced Dicing Technologies Inc. specializes in the design, integration, and upgrade of precision semiconductor manufacturing equipment, with a focused expertise in dicing saw systems and ultraviolet curing technologies. The company delivers mission-critical hardware and software solutions for wafer dicing, including automated saw calibration, software firmware upgrades, and UV curing station deployment—ensuring high-yield, low-defect processing of advanced semiconductor substrates. Their technical proficiency spans mechanical precision engineering, process automation, and embedded control systems tailored for cleanroom environments, with a demonstrated ability to enhance throughput and repeatability in high-purity semiconductor fabrication workflows. Differentiators include rapid field deployment of customized tooling upgrades and deep integration of process-specific software stacks for real-time process monitoring and control. The contractor maintains a strong relationship with the National Aeronautics and Space Administration, providing specialized dicing and curing equipment for space-grade semiconductor components used in radiation-hardened avionics and sensor systems. They also support the Department of Defense with similar technologies, enabling the production of reliable microelectronics for defense aerospace and electronic warfare platforms. Their work for these agencies consistently involves high-reliability, low-volume manufacturing support requiring stringent environmental and process controls. Their primary industry focus is semiconductor and related device manufacturing, where they serve as a niche provider of advanced dicing and curing subsystems critical to the fabrication of integrated circuits for aerospace, defense, and high-performance computing. They position themselves as a technical partner for organizations requiring precision process equipment that meets the demanding tolerances of advanced node semiconductor production. Advanced Dicing Technologies Inc. is a small business structured as a 2L entity, headquartered in Horsham, Pennsylvania. The company holds no federal certifications but maintains a focused geographic footprint in the Mid-Atlantic region, serving government and defense contractors with specialized manufacturing equipment solutions.
Key Performance Metrics
Awards Count
16
All time
Active
0
Currently performing
Completed
16
Past period of performance
Total Awards
All time
Contracts
Prime · all time
Subcontracts
Sub · all time
Grants
Prime · all time
Subgrants
Sub · all time
Award Analytics & Distribution
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