MULTILAYER TECHNOLOGY GROUP, INC

Multilayer Technology Group, Inc. specializes in the design, fabrication, and assembly of high-reliability printed circuit boards and electronic assemblies for defense systems. Their core capabilities center on precision printed circuit assembly (PCA) under stringent military and aerospace standards, including compliance with AS9102 First Article Inspection Requirements. The contractor delivers mission-critical components such as breakout boards, signal conditioning modules, power supply fixtures, and RF carrier boards used in missile defense, communications, and avionics systems. Technical expertise includes stencil fabrication, GPC-to-WAWF logistics integration, and assembly of complex electrical and electronic subsystems requiring tight tolerances and rigorous quality control. Their focus on end-to-end electronic assembly—from board-level manufacturing to final integration—positions them as a trusted niche supplier for embedded systems requiring ruggedized, high-performance electronics. The company maintains a consistent and deep relationship with the Department of Defense, supplying electronic assemblies across multiple program areas including tactical missile defense, electronic warfare, and command and control systems. Work is typically delivered under existing indefinite-delivery/indefinite-quantity contracts, indicating established trust and repeat engagement for rapid prototyping and low-volume production of specialized hardware. Their primary industry focus is printed circuit assembly manufacturing (NAICS 334418), serving the defense electronics supply chain with an emphasis on custom, non-recurring engineering solutions for legacy and next-generation military platforms. They operate as a small business with a lean operational structure based in Irving, Texas, and hold no formal government certifications, relying instead on demonstrated technical performance and quality execution to maintain their position in the defense electronics market.