This Sources Sought opportunity from Department Of Defense was posted on September 19, 2005. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
10--RDECOM is seeking sources for the application of technologies to perform thermal management in electronic enclosures by dissipation or removal of heat generated internal to the electronic enclosures in air, missile and ground weapon systems.
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The Research, Development and Engineering Command Engineering Directorate is conducting a market survey to identify potential vendors capable of developing innovative thermal management technologies for electronic enclosures used in air, missile, and ground weapon systems. The primary objective is to find advanced methods for dissipating or removing internal heat, with a specific focus on modifying existing cold plate materials or implementing entirely new mechanisms to replace them. Interested parties are expected to demonstrate potential weight and volume savings compared to current technology. Respondents must submit their general technical approach along with evidence of their experience and qualifications to transition manufacturing technology into a production capability. This request for information is issued in accordance with FAR Clause 52.215.3, meaning it is for market research purposes only and does not constitute a solicitation for a contract award. Supporting documentation must be submitted to the designated points of contact at the U.S. Army Aviation and Missile Command and the Aviation and Missile Research Development and Engineering Center by October 7, 2005.
General Info
Place of Performance
U.S. Army Aviation and Missile Research Development and Engineering Center (AMRDEC) ATTN: AMSRD-AMR-SE-MT, Building 5400 Redst, ALSet-Aside
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Timeline
Submission Closed
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