59 -- INDUCTIVELY COUPLED PLASMA SOURCE
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The U.S. Department of Commerce's National Institute of Standards & Technology (NIST) intends to award a sole source contract to Trion Technology for an inductively coupled plasma (ICP) source unit designed to enhance the capabilities of a recently acquired Minilock-Phantom III reactive ion etching (RIE) system. This RIE system is a compact, vacuum load-locked device used in research and failure analysis labs to perform plasma etching on single wafers, dies, or parts up to 200mm in size. The load-lock feature improves user safety by preventing direct contact with the process chamber and residual etch materials while maintaining the chamber under vacuum to prevent moisture and corrosion. Integrating the ICP source will significantly improve etch rates, profile control, uniformity, selectivity, and reduce radiation damage and contamination associated with RIE sputtering, benefiting materials such as oxides, III-V semiconductors, polyimide, polysilicon, and radiation-sensitive active devices. This procurement will follow simplified acquisition procedures under the Federal Acquisition Regulation (FAR) Part 13.1 since the value is under $100,000. A sole source contract is justified because Trion Technology is already assembling the Minilock-Phantom III system, and using ICP source units from other vendors would void the equipment warranty and is incompatible with the system’s proprietary computer controls and software. Though the notice serves informational purposes and does not anticipate competitive bidding, responses addressing the qualifications related to this requirement will be considered to determine if competitive competition would serve the Government’s interests. Technical inquiries must be submitted in writing before June 15, 2007, with an anticipated contract award date of June 18, 2007. The contracting office is located in Seattle, WA, with Kelly A Rima as the point of contact.
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