This Government Contract opportunity from Department Of Defense was posted on April 29, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Bond Setup and Process Engineering

Closed

Federal

Submission Closed05/04/2026, 04:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334418

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AI Contract Overview

This contract involves a one-time bond setup and process engineering effort focused on wire bonding and die attach operations for 28-QFN packages, with an emphasis on integrating validation protocols and optical inspection systems to ensure quality and reliability. The work requires precise technical execution tailored to the specific geometries and material requirements of the 28-QFN package type, ensuring optimal performance and yield in high-reliability electronic assemblies. The project scope includes developing and documenting standardized processes, validating process parameters, and embedding in-line optical inspection capabilities to detect defects early in the production flow. The contract is issued as a subcontract under a Total Small Business Set-Aside, designated under NAICS code 334418, and managed by Niwc Pacific within the Department of Defense. The place of performance is in San Diego, California, with a response deadline of May 4, 2026, at 4:00 PM. This opportunity is exclusively available to small businesses as defined by the Small Business Administration, reflecting a commitment to fostering vendor diversity and technical innovation within the defense supply chain. There is no specified point of contact in the provided data, and all submissions must be made through the official SAM.gov portal linked in the solicitation.

General Info

One-time bond and die attach engineering for 28-QFN packages with optical inspection, under DoD small business set-aside in San Diego.

Agency

Department Of Defense → Niwc PacificView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

San Diego, CA, 92110, USA

Set-Aside

SBA

Documents

This scope was carved out of N66001-26-Q-6110.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

NOTICE: Intent to Award Sole Source – GOLDEN ALTOS CORPORATION – for QFN packages and QFN test sockets for custom designed IC

AI Contract Breakdown

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Timeline

PhaseClosed

PostedApr 29

subcontract

Response DeadlineMay 4

Deadline has passed

Submission Closed

05/04/2026, 04:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → Niwc Pacific

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → Niwc Pacific

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

One-time bond setup and process engineering for wire bonding and die attach on 28-QFN packages, including validation and optical inspection integration.