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Digital Backplane Assembly and Integration

Active

Federal

Response Deadline11/30/2026, 09:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract for Digital Backplane Assembly and Integration supports AFLCMC/ESGK-R Strategic Ground Sensors projects for the Department of Defense. The scope of work involves the population of printed circuit boards with electronic components for prime contractors, specifically focusing on the delivery of fully populated and soldered Digital Backplane Assemblies. Technical requirements include executing surface mount technology placement, through-hole soldering, and the manual assembly of heavy-duty backplane connectors using specialized pick-and-place machines and X-ray inspection processes. To qualify for this contract, providers must maintain IPC-A-610 and J-STD-001 certifications to ensure compliance with industry assembly and soldering standards. The work is classified under NAICS code 334418 and is designated to be performed in Warner Robins. Interested parties must submit their responses by the deadline of November 30, 2026, to be considered for this specialized electronic manufacturing opportunity.

General Info

Subcontract for digital backplane assembly and integration for DoD strategic ground sensor projects.

Agency

Department Of Defense → FA8507 Alcmc Eskc

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

Warner Robins, GA, USA

Set-Aside

NONE

Documents

This scope was carved out of FA8507_DPA_SourcesSought.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Digital Backplane Assembly

AI Contract Breakdown

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Timeline

PostedSep 28

subcontract

Response DeadlineNov 30

Submission deadline

Response Deadline

11/30/2026, 09:00:00 PM UTCin about 1 month

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Organization & Contact Information

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AgencyDepartment Of Defense → FA8507 Alcmc Eskc

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → FA8507 Alcmc Eskc

Office AddressN/A

ContactsNo contact information available

Full Description

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Performs population of PCBs with electronic components for prime contractors on AFLCMC/ESGK-R Strategic Ground Sensors projects. Executes SMT placement, through-hole soldering, and manual assembly of heavy-duty backplane connectors using pick-and-place machines and X-ray inspection. Requires IPC-A-610 and J-STD-001 certifications. Delivers fully populated and soldered Digital Backplane Assemblies.

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