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Dry and Wet Etching Services

Active

Federal

Response Deadline08/17/2026, 08:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract opportunity with the NASA Shared Services Center involves providing specialized dry and wet etching services for silicon carbide wafers. The scope of work focuses on the precision etching of metal layers and silicon dioxide using both plasma and chemical methods. The solicitation was posted on August 12, 2026, with a response deadline of August 17, 2026. This requirement falls under NAICS code 334419 and is managed by the National Aeronautics And Space Administration.

General Info

NASA subcontract for specialized dry and wet etching services for silicon carbide wafers.

Agency

National Aeronautics And Space Administration → NASA Shared Services CenterView Agency

NAICS

334419 - Other Electronic Component ManufacturingView NAICS

Place of Performance

MS

Set-Aside

NONE

Documents

This scope was carved out of 80NSSC26941665Q.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Surface Micromachining of Single Crystal Silicon Carbide Sensors

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Timeline

PostedAug 12

subcontract

Response DeadlineAug 17

Submission deadline

Response Deadline

08/17/2026, 08:00:00 PM UTCin 4 days

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Organization & Contact Information

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AgencyNational Aeronautics And Space Administration → NASA Shared Services Center

ContactsNo contacts available

OfficeN/A

Organization / Agency

National Aeronautics And Space Administration → NASA Shared Services Center

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Precision etching of silicon dioxide and metal layers using plasma (dry) and chemical (wet) methods on SiC wafers.

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