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Plasma Cleaning Services

Active

Federal

Response Deadline08/17/2026, 08:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The NASA Shared Services Center is seeking a subcontractor for Plasma Cleaning Services to perform surface preparation and contamination removal on SiC wafers. The scope of work specifically involves the use of RF/DC plasma to clean wafers prior to critical deposition or bonding steps. This opportunity is categorized under NAICS code 334419 and was posted on August 12, 2026. Interested parties must submit their responses by the deadline of August 17, 2026, at 8:00 PM.

General Info

NASA seeks a subcontractor for SiC wafer plasma cleaning services by August 17.

Agency

National Aeronautics And Space Administration → NASA Shared Services CenterView Agency

NAICS

334419 - Other Electronic Component ManufacturingView NAICS

Place of Performance

MS

Set-Aside

NONE

Documents

This scope was carved out of 80NSSC26941665Q.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Surface Micromachining of Single Crystal Silicon Carbide Sensors

AI Contract Breakdown

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Timeline

PostedAug 12

subcontract

Response DeadlineAug 17

Submission deadline

Response Deadline

08/17/2026, 08:00:00 PM UTCin 4 days

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Organization & Contact Information

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AgencyNational Aeronautics And Space Administration → NASA Shared Services Center

ContactsNo contacts available

OfficeN/A

Organization / Agency

National Aeronautics And Space Administration → NASA Shared Services Center

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Office AddressN/A

ContactsNo contact information available

Full Description

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Surface preparation and contamination removal using RF/DC plasma prior to deposition or bonding steps on SiC wafers.

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