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Silicon Carbide Wafer Supply

Active

Federal

Response Deadline08/17/2026, 08:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The National Aeronautics And Space Administration, through the NASA Shared Services Center, is seeking a subcontractor for the supply of 4H-SiC wafers. These specific materials must be 4 inches in diameter and 350 microns thick to serve as substrates for semiconductor sensor fabrication. The opportunity was posted on August 12, 2026, with a response deadline of August 17, 2026. This procurement falls under NAICS code 325998 and is categorized as a subcontract.

General Info

NASA seeks a subcontractor for 4-inch 4H-SiC wafers for semiconductor sensor fabrication.

Agency

National Aeronautics And Space Administration → NASA Shared Services CenterView Agency

NAICS

325998 - All Other Miscellaneous Chemical Product and Preparation ManufacturingView NAICS

Place of Performance

MS

Set-Aside

NONE

Documents

This scope was carved out of 80NSSC26941665Q.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Surface Micromachining of Single Crystal Silicon Carbide Sensors

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No contract breakdown available.

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Timeline

PostedAug 12

subcontract

Response DeadlineAug 17

Submission deadline

Response Deadline

08/17/2026, 08:00:00 PM UTCin 4 days

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Organization & Contact Information

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AgencyNational Aeronautics And Space Administration → NASA Shared Services Center

ContactsNo contacts available

OfficeN/A

Organization / Agency

National Aeronautics And Space Administration → NASA Shared Services Center

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Supply of 4-inch diameter, 350-micron thick 4H-SiC wafers for use as substrates in semiconductor sensor fabrication.

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