This Government Contract opportunity from Department Of Defense was posted on August 18, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Emerging Security Materials and Processes

Closed

Federal

Submission Closed09/16/2026, 10:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 541715

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FA2391 USAF Afmc Afrl Pzl Afrl Rqkp

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Solicitation # 89233127RNA000340

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1 day ago

DEADLINE

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AI Contract Overview

The Emerging Security Materials and Processes subcontract, issued by the Department of the Army, focuses on the supply and development of innovative materials and processes designed for microelectronic security. Supporting prime contractors on Army DEVCOM AvMC projects, the initiative involves researching and applying new materials that are compatible with contemporary microelectronic manufacturing and packaging through the use of experimental fabrication processes. A critical requirement for this effort is that all developed materials or processes must reach a minimum Technology Readiness Level of 4. The ultimate goal of the contract is the delivery of novel materials or detailed process specifications specifically intended for secure packaging. Interested parties should note the response deadline of September 16, 2026.

General Info

Army subcontract for microelectronic security materials and processes due September 16, 2026.

Agency

Department Of Defense → Department Of The Army

NAICS

541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)

Place of Performance

USA

Set-Aside

NONE

Documents

This scope was carved out of W52P1J26R0001.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies

AI Contract Breakdown

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Timeline

PhaseClosed

PostedAug 18

subcontract

Response DeadlineSep 16

Deadline has passed

Submission Closed

09/16/2026, 10:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → Department Of The Army

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → Department Of The Army

Office AddressN/A

ContactsNo contact information available

Full Description

Supplies and develops novel materials and processes for microelectronic security for prime contractors on Army DEVCOM AvMC projects. Researches and applies new materials compatible with modern microelectronic manufacturing and packaging using experimental fabrication processes. Requires minimum TRL 4. Delivers novel materials or process specifications for secure packaging.