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This Government Contract opportunity from Department Of Defense was posted on May 19, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

ESD/EMI-Sensitive Packaging and Preservation

Closed
Federal

Contract Overview

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This contract focuses on the design and execution of protective packaging systems specifically tailored for electronic components sensitive to Electrostatic Discharge (ESD) and Electromagnetic Interference (EMI). The packaging solutions must adhere to rigorous military standards, including MIL-PRF-81705 and MIL-STD-2073-1E, ensuring high levels of protection and preservation during handling and transportation. The work is to be performed primarily in San Diego, CA, with a deadline for proposal responses set for late May 2026. The subcontract falls under NAICS code 323113 and is issued by the ASC Supplier Oper OEM Division within the Department of Defense. Although certain organizational and set-aside details are unspecified, the contract emphasizes compliance with established military packaging protocols to protect sensitive electronics effectively. This opportunity requires expertise in military-grade packaging materials and methods to meet stringent defense industry requirements.

General Info

Design and deliver military-standard protective packaging for ESD/EMI-sensitive electronics, proposal due May 2026.

Agency

Department Of Defense → ASC SUPPLIER OPER OEM DIVISION

NAICS

323113 - Commercial Screen Printing View NAICS

Place of Performance

SAN DIEGO, CA, 92136-3581, US

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → ASC SUPPLIER OPER OEM DIVISION
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → ASC SUPPLIER OPER OEM DIVISION
Office AddressN/A
ContactsNo contact information available

Full Description

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Design and execution of protective packaging systems for ESD/EMI-sensitive electronic components using MIL-PRF-81705 and MIL-STD-2073-1E compliant materials and methods.