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Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) BAA

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The Defense Advanced Research Projects Agency is seeking innovative proposals for the Heterogenous Adaptively Produced Photonic Interfaces project, focusing on advanced concepts for high-density three-dimensional chip-to-chip and intra-chip optical routing within integrated photonic microsystems. The agency is specifically targeting revolutionary advances in science, devices, or systems, while explicitly excluding research that offers only evolutionary improvements to current practices. This opportunity is identified as a high-confidence full recompete of contract HR001125C0043, currently held by SRI International with a value of 3,964,966 dollars. The current contract is expected to end on December 13, 2026. The upcoming procurement will be conducted via full and open competition using a cost plus fixed fee pricing structure under NAICS code 541715.

General Info

DARPA seeks innovative proposals for high-density 3D integrated photonic optical routing systems.

Agency

Department Of Defense → Defense Advanced Research Projects Agcy

NAICS

541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)

Place of Performance

VA, 940253493, USA

Set-Aside

NONE

Documents

0

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Timeline

1 update
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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Advanced Research Projects Agcy
Contacts1 person available
OfficeARLINGTON, VA, 222032114, USA
Organization / AgencyDepartment Of Defense → Defense Advanced Research Projects Agcy
Office AddressARLINGTON, VA, 222032114, USA
Contacts
BAA Coordinator
contact@example.gov

Full Description

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Predicted recompete opportunity based on federal award data.
Current Contract: HR001125C0043 Incumbent: SRI INTERNATIONAL Contract Value: $3,964,966 Potential End Date: 2026-12-13T00:00:00.000Z Competition: FULL AND OPEN COMPETITION Pricing: COST PLUS FIXED FEE Classification: full-recompete (Confidence: high - 90/100)
The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative proposals in the following technical areas: Advanced concepts for high-density three-dimensional chip-to-chip and intra-chip optical routing in integrated photonic microsystems. Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices, or systems. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.

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