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Low-Dimensional Semiconductor Materials Synthesis & Metrology

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Federal

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This subcontract under the National Science Foundation's Directorate For Technology, Innovation, and Partnerships involves the synthesis of low-dimensional semiconductor materials for prime contractors on NSF ELEGANT projects. The primary objective is to produce 300mm wafers that meet specific industry-defined criteria for foundry process-qualification entry, utilizing high-precision metrology equipment and specialized synthesis tools. The project is governed by NAICS code 325211 and requires strict compliance with CHIPS Act restrictions regarding foreign entities of concern. Interested parties must respond by December 18, 2026, to provide materials that satisfy the rigorous qualification standards necessary for foundry entry.

General Info

NSF subcontract for 300mm semiconductor wafer synthesis meeting foundry qualification and CHIPS Act.

NAICS

325211 - Plastics Material and Resin Manufacturing

Place of Performance

1180, VA, USA

Set-Aside

NONE

Documents

This scope was carved out of NSF-OTASO-FY26-ELEGANT.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

NSF Ecosystem for Low-dimensional Electronics: Growth, Assembly, Nanoelectronics, and Translation (NSF ELEGANT)

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Organization & Contact Information

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AgencyNational Science Foundation → Directorate For Technology, Innovation, & Partnerships
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Performs the synthesis of low-dimensional semiconductor materials for prime contractors on NSF ELEGANT projects. Synthesizes materials to meet industry-defined specifications for foundry process-qualification entry using 300mm wafer synthesis tools and high-precision metrology equipment. Must comply with CHIPS Act foreign entity of concern restrictions. Delivers 300mm wafers meeting foundry qualification entry criteria.

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