Low-D Device and Full-Chip Prototype Demonstration
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This subcontract, titled Low-D Device and Full-Chip Prototype Demonstration, is issued by the National Science Foundation's Directorate For Technology, Innovation, & Partnerships. The project focuses on the design and fabrication of functional full-chip level prototypes for prime contractors on NSF ELEGANT projects. The primary objective is to achieve a 10X improvement in power, performance, area, and cost over standard CMOS nodes through device-circuit co-designs, variability-aware circuit sizing, and standard-cell characterization using advanced fabrication and testing equipment. The contract requires strict compliance with CHIPS Act restrictions and falls under NAICS code 334413. Interested parties must respond by December 18, 2026, to provide the required functional full-chip level prototypes.
General Info
Place of Performance
1180, VA, USASet-Aside
Documents
This scope was carved out of NSF-OTASO-FY26-ELEGANT.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
NSF Ecosystem for Low-dimensional Electronics: Growth, Assembly, Nanoelectronics, and Translation (NSF ELEGANT)
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Timeline
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Organization & Contact Information
Full Description
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