Semiconductor Manufacturing Readiness & Domestic Supply Chain Mapping
Contract Overview
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AI Contract Overview
This subcontract, managed by the National Science Foundation's Directorate For Technology, Innovation, & Partnerships, focuses on semiconductor manufacturing readiness and domestic supply chain mapping for NSF ELEGANT projects. The selected provider will perform economic and logistical analyses for prime contractors, which includes developing 300mm tool qualification roadmaps and creating detailed manufacturing cost and yield models. A primary objective of the contract is the qualification of domestic suppliers for substrates and precursors through the use of supply chain mapping software. The contractor is required to deliver a comprehensive manufacturing readiness package and must strictly adhere to the foreign entity of concern restrictions mandated by the CHIPS Act. The solicitation was posted on September 17, 2026, with a response deadline of December 18, 2026.
General Info
Place of Performance
1180, VA, USASet-Aside
Documents
This scope was carved out of NSF-OTASO-FY26-ELEGANT.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
NSF Ecosystem for Low-dimensional Electronics: Growth, Assembly, Nanoelectronics, and Translation (NSF ELEGANT)
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Organization & Contact Information
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