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Semiconductor Manufacturing Readiness & Domestic Supply Chain Mapping

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Federal

Contract Overview

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This subcontract, managed by the National Science Foundation's Directorate For Technology, Innovation, & Partnerships, focuses on semiconductor manufacturing readiness and domestic supply chain mapping for NSF ELEGANT projects. The selected provider will perform economic and logistical analyses for prime contractors, which includes developing 300mm tool qualification roadmaps and creating detailed manufacturing cost and yield models. A primary objective of the contract is the qualification of domestic suppliers for substrates and precursors through the use of supply chain mapping software. The contractor is required to deliver a comprehensive manufacturing readiness package and must strictly adhere to the foreign entity of concern restrictions mandated by the CHIPS Act. The solicitation was posted on September 17, 2026, with a response deadline of December 18, 2026.

General Info

NSF subcontract for semiconductor supply chain mapping, cost modeling, and domestic supplier qualification.

NAICS

541611 - Administrative Management and General Management Consulting Services

Place of Performance

1180, VA, USA

Set-Aside

NONE

Documents

This scope was carved out of NSF-OTASO-FY26-ELEGANT.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

NSF Ecosystem for Low-dimensional Electronics: Growth, Assembly, Nanoelectronics, and Translation (NSF ELEGANT)

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Organization & Contact Information

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AgencyNational Science Foundation → Directorate For Technology, Innovation, & Partnerships
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Performs economic and logistical analysis for prime contractors on NSF ELEGANT projects. Develops 300mm tool qualification roadmaps, creates manufacturing cost and yield models, and qualifies domestic suppliers for precursors and substrates using supply chain mapping software. Must comply with CHIPS Act foreign entity of concern restrictions. Delivers a manufacturing readiness package.

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