This Government Contract opportunity from National Aeronautics And Space Administration was posted on June 4, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Mandatory Equipment Options Integration

Closed

Federal

Submission Closed06/11/2026, 08:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

Active Opportunities Like This One

NAICS: 333242

New

Canada

Inductively Coupled Plasma (ICP) Processing ModuleThe contract involves the supply and delivery of an Inductively Coupled Plasma (ICP) etch module designed to be compatible with the existing KLA/SPTS Omega fxP platform, which is utilized in semiconductor fabrication processes. This subcontract opportunity is issued by the National Research Council of Canada, under the Government of Canada, and targets suppliers capable of providing advanced equipment for semiconductor manufacturing technologies. The solicitation was posted on June 12, 2026, with a response deadline of June 29, 2026, indicating a relatively short window for submission. The contract falls under the NAICS code 333242, which relates to semiconductor and other electronic component manufacturing machinery. The work will be performed in Canada, aligning with the government’s efforts to support domestic technology and research capabilities in high-tech sectors. Interested parties are prompted to respond promptly, considering the firm deadlines and specialized nature of the contract.

National Research Council of Canada

POSTED

DEADLINE

ACAN 26-58022 Automated Wafer Defect Inspection System and ICP Plasma Processing ModuleThe National Research Council Canada, through the Canadian Photonics Fabrication Centre, intends to procure an Automated Wafer Defect Inspection System (Surface Defect Inspection Platform - SDIP) and an Inductively Coupled Plasma (ICP) Processing Module to support advanced semiconductor photonic device fabrication. The SDIP system must provide non-destructive, laser-based, high-resolution optical surface inspection capable of detecting and characterizing sub-micron defects on various compound semiconductor substrates including GaAs, InP, GaN, sapphire, Si, Ge, and GaN on SiC. It will incorporate automated cassette-to-cassette wafer handling, generate detailed defect maps, and support integration with existing inspection workflows and data sets. The ICP processing module must integrate seamlessly with the existing KLA/SPTS Omega fxP plasma processing platform, supporting high-density plasma etching for 4-inch wafers of compound semiconductor materials, maintaining compatibility with current hardware, software, and process controls. Due to the proprietary nature of the existing Omega fxP system, KLA Corporation is the sole supplier capable of meeting the technical requirements and ensuring operational interoperability and system coherence. The procurement is subject to multiple trade agreements with invoked exceptions for limited tendering based on a lack of competition for technical reasons and intellectual property considerations. Delivery deadlines are set for March 31, 2027, for the SDIP system and June 30, 2027, for the ICP module. While a pre-identified supplier has been named, other suppliers may submit statements of capabilities by June 29, 2026, to demonstrate their qualifications for the contract. All supplied electrical equipment must comply with Canadian Electrical Code certification standards.

National Research Council of Canada

POSTED

DEADLINE

Surface Mount Soldering Stations SupplyThis contract involves the supply of four high-power surface mount soldering stations equipped with variable temperature control and vacuum capabilities, similar to the PACE PRC2000 models. The equipment is intended to support advanced soldering operations, ensuring precision and efficiency in surface mount technology processes. The stations are to be delivered to the Department of Defense, specifically to a location in Tobyhanna. Issued by the Department of Defense under NAICS code 333242, this subcontract opportunity was posted on June 12, 2026, with a response deadline set for June 25, 2026. The solicitation requires bidders to provide these specialized soldering stations, which are essential for military or defense manufacturing or maintenance activities. The contract highlights the need for equipment that combines high power, precise temperature control, and vacuum functions to meet the demands of surface mount soldering tasks within defense applications.

W6QK Acc-Apg Cont Ct Tyad Ofc

POSTED

DEADLINE

TPT Manual Wire BonderThe National Institute of Standards and Technology (NIST) is conducting a sources sought notice to gather information from potential suppliers capable of providing a TPT manual wire bonder that meets specific technical criteria. The wire bonder must support multiple bonding modes, including wedge, ball, and ribbon wire bonding, with quick reconfiguration within five minutes. It should allow fully manual control over the X, Y, and Z axes during operation and accommodate gold and aluminum wire diameters ranging from 17 to 75 micrometers, as well as ribbon wire widths from 20 to 250 micrometers. Key system features include an ultrasonic transducer operating between 60 and 70 kHz with PLL control, power output up to 10 watts, adjustable bond time and force ranges, a 90-degree wire feed angle, motorized wire clamp, adequate throat depth and table motion, and a temperature controller with high precision and a limit of at least 250°C. The equipment must be compact, fitting within a tabletop footprint smaller than 600 x 600 x 300 mm. The interface requirements specify an integrated operator display supporting storage of a minimum of 20 bonding programs and allowing easy parameter adjustments. Respondents are asked to submit company details, capabilities relative to the requirements, reseller authorization status, any perceived restrictive aspects of the specifications, and their small business status through email by the stated deadline. The notice clarifies that this is not a solicitation or request for quotations, no contract will be awarded directly from this notice, and respondents bear no costs. NIST intends to use the information received for future procurement planning and may engage further with interested firms to refine its requirement understanding. All questions must be submitted by a specified date to be addressed through an amendment.

Department Of Commerce Nist

POSTED

DEADLINE

Low Profile IR Preheater SupplyThe contract involves the procurement of four low-profile infrared preheaters designed for electronics rework applications. Each unit will have a power output of 1.6 kW and be capable of reaching a maximum temperature of 200°C, with specifications similar to the PACE PH100E model. These preheaters are intended to support precise heating needs in sensitive electronic component repair and assembly processes. Issued by the Department of Defense through its W6QK Acc-Apg Cont Ct Tyad Office, the contract is classified under NAICS code 333242, which pertains to semiconductor and related device manufacturing. The equipment is to be delivered to a performance location in Tobyhanna and the solicitation was posted on June 12, 2026, with a response deadline of June 25, 2026. This opportunity is a subcontract arrangement, facilitating the supply of specialized infrared heating devices to support defense-related electronics maintenance and production operations.

W6QK Acc-Apg Cont Ct Tyad Ofc

POSTED

5 days ago

DEADLINE

in 9 days

AI Contract Overview

This contract involves the supply and integration of specific essential equipment including a 12K-HSK-A63-VF spindle, a high-pressure coolant system, and a 32GB memory upgrade. The procurement is categorized as a subcontract with a total small business set-aside under FAR 19.5, indicating that only small businesses are eligible to participate. The contract falls under the NAICS code 333242, which pertains to machining and machining-related services. Issued by the NASA Shared Services Center on June 4, 2026, the contract requires responses by June 11, 2026, and the work will be performed primarily in Hampton, VA, zip code 23681. This project supports NASA's ongoing efforts to enhance their operational capabilities through targeted equipment upgrades, emphasizing performance improvements and technological integration in their machining processes.

General Info

Small business subcontract for NASA equipment supply, including spindle, coolant system, and memory upgrade.

Agency

National Aeronautics And Space Administration → NASA Shared Services Center

NAICS

333242 - Semiconductor Machinery Manufacturing View NAICS

Place of Performance

Hampton, VA, 23681, USA

Set-Aside

SBA

Documents

(0)

No documents available

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Timeline

PhaseClosed

PostedJun 4

subcontract

Response DeadlineJun 11

Deadline has passed

Submission Closed

06/11/2026, 08:00:00 PM UTC

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Organization & Contact Information

AgencyNational Aeronautics And Space Administration → NASA Shared Services Center

ContactsNo contacts available

OfficeN/A

Organization / Agency

National Aeronautics And Space Administration → NASA Shared Services Center

Office AddressN/A

ContactsNo contact information available

Full Description

Supply and integration of required accessories: 12K-HSK-A63-VF spindle, high-pressure coolant system, and 32GB memory upgrade.