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Microcircuit Manufacturing and Testing

Active

Federal

Response Deadline07/27/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The contract calls for the manufacture, testing, and qualification of microcircuits to meet rigorous military-grade standards, encompassing full-cycle operations from wafer fabrication to parametric testing and environmental stress screening. All work must adhere to defense specifications ensuring reliability, performance, and durability under extreme operational conditions. The effort is governed under NAICS code 334413 and is classified as a subcontract within the Department of Defense’s Active Devices Division, with performance required at a facility located in Columbus, Ohio, with a ZIP code of 43213. The solicitation was posted on July 16, 2026, and responses must be submitted by July 27, 2026, providing a strict eleven-day window for proposal submission. The contract does not specify any set-aside provisions and is accessible through the DIBBS portal for interested parties.

General Info

Manufacture and test military-grade microcircuits in Columbus, Ohio, by July 27, 2026, per DoD specifications.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

334413 - Semiconductor and Related Device ManufacturingView NAICS

Place of Performance

COLUMBUS, OH, 43213, US

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

PostedJul 16

subcontract

Response DeadlineJul 27

Submission deadline

Response Deadline

07/27/2026, 05:00:00 PM UTCin 9 days

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → ACTIVE DEVICES DIVISION

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Office AddressN/A

ContactsNo contact information available

Full Description

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Manufacture, test, and qualify microcircuits to military-grade standards including wafer fabrication, parametric testing, and environmental stress screening.

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