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This Combined Synopsis/Solicitation opportunity from Department Of Defense was posted on March 23, 2023. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Multiple Award PCB Fab and Assembly BPAs

Awarded
HQ072723RRC01Federal

Contract Overview

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The Defense Microelectronics Activity (DMEA) is establishing a pool of qualified Blanket Purchase Agreement (BPA) holders to provide turn-key Printed Circuit Board (PCB) fabrication and assembly services. This initiative supports the development of electronics solutions for Department of Defense obsolescence issues and state-of-the-art SatCom solutions, ranging from rapid developmental and prototype PCBAs to high-quality units for operational environments. The contract is a total small business set-aside under FAR Part 13 Simplified Acquisition Procedures, with a maximum ordering ceiling of 1.2 million dollars per BPA holder over a three-year period ending March 31, 2026. The procurement process involves a two-phase evaluation focusing on technical capability, past performance, and pricing. Requirements include in-house fabrication and assembly capabilities, strict chain of custody for components, and adherence to IPC Class 3 for fabrication and IPC Class 2 for assembly. Additionally, the solicitation serves as a request for quote for an initial order of 500 PCB units. Qualified vendors must demonstrate the ability to procure components from authorized sources and manage Government Furnished Material while potentially meeting ITAR or Trusted capabilities.

General Info

Contract Value

$25,848.86

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

CA, USA

Set-Aside

SBA

Award Issued Date

Documents

4

DMEA 22-2D6 Turn Key PCB Fabrication and Assembly BPA Scope

PDF, High priority: read this firstsow
High

Draft BPA Agreement - PWS 22-2D6 (PCB Fab and Assembly)

PDF, High priority: read this firstcontract-document
High

PWS 22-2D6 PCB Fabrication and Assembly BPA

PDF, High priority: read this firstrfp
High

PWS 22-2D6 Proposal Instructions and Evaluation Criteria

PDF, High priority: read this firstrfp
High

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Timeline

1 update
PhaseAwarded
Posted

Combined Synopsis

Notice updated

Response deadline changed from Apr 3, 2023 to Apr 4, 2023. The notice description changed.

Awarded

Contract was awarded

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Microelectronics Activity
Contacts2 people available
OfficeMCCLELLAN, CA, 956522100, USA
Office AddressMCCLELLAN, CA, 956522100, USA
Contacts

Full Description

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(Correction on 23 March 2023 - to correct a 1 day error on the proposal due date) DMEA's mission includes developing electronics solutions that solve DoD obsolescence issues and/or provides state of the art SatCom solutions to DoD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DoD operational environments. The purpose of this solicitation to is to competitively establish a pool of qualified BPA holders in order to rapidly obtain electronics products from industry and commercial PCB Fabrication and/or Assembly companies; specifically those produced by PCB Fabrication and PCB Assembly processes. Maximum ordering ceiling for each BPA holder is $1.2M over a 3 year period. Additionally, the second phase of proposal and evaluation described in this solicitation serves as an RFQ for an actual order of PCBs, for which the Government anticipates multiple initial orders to be placed to have 500 units PCBs delivered. Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, proposal instructions and evaluation criteria, and DRAFT BPA Agreement language. Proposals are due to the Contracting Officer, Robert Crandell, via e-mail to contact@example.gov, no later than 2:00pm (Pacific), Tuesday, 4 April 2023.

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