This Combined Synopsis/Solicitation opportunity from Department Of Defense was posted on March 23, 2023. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Multiple Award PCB Fab and Assembly BPAs
Contract Overview
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The Defense Microelectronics Activity (DMEA) is establishing a pool of qualified Blanket Purchase Agreement (BPA) holders to provide turn-key Printed Circuit Board (PCB) fabrication and assembly services. This initiative supports the development of electronics solutions for Department of Defense obsolescence issues and state-of-the-art SatCom solutions, ranging from rapid developmental and prototype PCBAs to high-quality units for operational environments. The contract is a total small business set-aside under FAR Part 13 Simplified Acquisition Procedures, with a maximum ordering ceiling of 1.2 million dollars per BPA holder over a three-year period ending March 31, 2026. The procurement process involves a two-phase evaluation focusing on technical capability, past performance, and pricing. Requirements include in-house fabrication and assembly capabilities, strict chain of custody for components, and adherence to IPC Class 3 for fabrication and IPC Class 2 for assembly. Additionally, the solicitation serves as a request for quote for an initial order of 500 PCB units. Qualified vendors must demonstrate the ability to procure components from authorized sources and manage Government Furnished Material while potentially meeting ITAR or Trusted capabilities.
General Info
Contract Value
$25,848.86Place of Performance
CA, USASet-Aside
Award Issued Date
Documents
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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