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Nordson PRO4 Tabletop Dispenser Supplier

Active
Federal

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This subcontract involves the procurement of one Nordson PRO4 Tabletop Dispenser, part number 7360860, for prime contractors working on Defense Microelectronics Activity projects. The equipment must be delivered fully functional to the DMEA facility and is required to support assembly projects in meeting MIL-STD-883 standards. The hardware specifications require a die placement accuracy of +/- .004 mm, integrated laser height detection, and the inclusion of interchangeable volumetric and auger pumps. This acquisition is managed under NAICS code 333914 for the Department of Defense.

General Info

Procurement of one Nordson PRO4 Tabletop Dispenser for DMEA Defense Microelectronics Activity projects.

NAICS

333914 - Measuring, Dispensing, and Other Pumping Equipment Manufacturing

Place of Performance

0, CA, 95652, USA

Set-Aside

NONE

Documents

This scope was carved out of HQ072727QJM01.

The full solicitation package (3 documents), including the RFP, is on the prime solicitation, not on this scope.

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Nordson PRO4 Tabletop Dispenser (Sole Source)

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Microelectronics Activity
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Supplies one Nordson PRO4 Tabletop Dispenser for prime contractors on Defense Microelectronics Activity (DMEA) projects. Provides hardware with +/- .004 mm die placement accuracy, laser height detection, and interchangeable auger/volumetric pumps. Hardware must enable assembly projects to meet MIL-STD-883 standards. Delivers one fully functional Nordson PRO4 Tabletop Dispenser (P/N 7360860) to the DMEA facility.

Similar Contracts

Same NAICS industry code

NAICS: 333914
New
Federal
Nordson PRO4 Tabletop Dispenser (Sole Source)
Solicitation # HQ072727QJM01
The Defense Microelectronics Activity (DMEA) is seeking a sole source, firm-fixed price purchase order for one Nordson PRO4 Tabletop Dispenser (Part Number 7360860) and associated on-site training for the software interface. This automated, vision-assisted tool will be utilized by the Packaging Assembly and Substrates Lab for microelectronics die bonding and encapsulation, specifically for the controlled application of coatings, lubricants, sealants, and adhesives. To meet MIL-STD-883 assembly standards, the hardware must feature a range of operation greater than 300x/300y/100z mm, a program capacity exceeding 100 programs, point-to-point and continuous path motion control, laser height detection, and the ability to swap between volumetric and auger pumps. Solicitation HQ072727QJM01 is categorized under NAICS code 333914 with a size standard of 750 employees. Quotes must be submitted via email to Contract Specialist Joe Molina by 10:00 AM PST on October 20, 2026. Award will be granted to the responsible offeror providing the best value based on a fair and reasonable price. The contract incorporates various Federal Acquisition Regulation clauses, including those regarding the System for Award Management, child and convict labor prohibitions, and DEI discrimination. Performance will take place in California, and the contractor is required to provide at least 48 hours' notice prior to any on-site activities.
Defense Microelectronics Activity

POSTED

about 14 hours ago

DEADLINE

in 13 days
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