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Novel Hard-Mask Material Developer/Supplier

Active
SBIR / STTR

Contract Overview

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This subcontract opportunity is for a Novel Hard-Mask Material Developer/Supplier to support prime contractors on DARPA SHIELDER projects. The selected provider will be responsible for supplying or synthesizing novel inorganic films or sputtered metals, specifically focusing on low-stress mask films that maintain an etch selectivity exceeding 150:1 under aggressive plasma conditions. All materials must be of semiconductor-grade purity to prevent contamination and must be compatible with standard lithographic workflows and patternable via secondary chemical plasma. The contract is issued by the Defense Advanced Research Projects Agency under the Department of Defense and is designated as a Total Small Business Set-Aside. Eligible applicants must meet SBIR/STTR mandates and employ fewer than 500 people. The scope of work involves the delivery of high-purity hard-mask materials or precursor chemicals, with a response deadline set for October 21, 2026.

General Info

Small business subcontract for supplying high-purity novel hard-mask materials for DARPA SHIELDER projects.

Documents

This scope was carved out of DPA26TZ06-DV004.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Scalable Hard-mask materials with Improved Etch resistance and Low Degradation for Extreme-aspect-Ratio fabrication (SHIELDER)

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Organization & Contact Information

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AgencyDepartment of Defense → Defense Advanced Research Projects Agency
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Supplies or synthesizes novel inorganic films or sputtered metals for prime contractors on DARPA SHIELDER projects. Synthesizes low-stress mask films with etch selectivity exceeding 150:1 under aggressive plasma conditions. Ensures materials are compatible with standard lithographic workflows and patternable via secondary chemical plasma. Requires semiconductor-grade purity to mitigate contamination. Delivers high-purity hard-mask materials or precursor chemicals.

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