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Extreme High-Aspect-Ratio Fabrication Specialist

Active

SBIR / STTR

Response Deadline10/21/2026, 04:00:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The Extreme High-Aspect-Ratio Fabrication Specialist subcontract supports DARPA SHIELDER projects by providing specialized deposition, patterning, and deep-etching of hard-mask materials. The scope of work involves executing scalable deposition and aggressive dry plasma etching to achieve 100:1 aspect ratios while maintaining strict critical dimension control and ensuring sidewall roughness remains below 2 nm RMS. Technical execution requires the use of DRIE systems alongside E-beam or photolithography tools to deliver high-precision fabricated wafers. This opportunity is a total small business set-aside under NAICS code 334413, specifically mandated for SBIR/STTR entities with fewer than 500 employees. To be eligible, contractors must adhere to cleanroom standards and maintain CMMC Level 1 certification. The response deadline for this Department of Defense requirement is October 21, 2026.

General Info

Small business subcontract for DARPA high-aspect-ratio wafer fabrication due October 21, 2026.

Agency

Department of Defense → Defense Advanced Research Projects Agency

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

Not specified

Set-Aside

SBA

Documents

This scope was carved out of DPA26TZ06-DV004.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Scalable Hard-mask materials with Improved Etch resistance and Low Degradation for Extreme-aspect-Ratio fabrication (SHIELDER)

AI Contract Breakdown

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Timeline

PostedSep 2

subcontract

Response DeadlineOct 21

Submission deadline

Response Deadline

10/21/2026, 04:00:00 AM UTCin 10 days

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Organization & Contact Information

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AgencyDepartment of Defense → Defense Advanced Research Projects Agency

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment of Defense → Defense Advanced Research Projects Agency

Office AddressN/A

ContactsNo contact information available

Full Description

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Performs deposition, patterning, and deep-etching of hard-mask materials for prime contractors on DARPA SHIELDER projects. Executes scalable deposition and aggressive dry plasma etching to achieve 100:1 aspect ratios. Maintains critical dimension control and ensures sidewall roughness < 2 nm RMS. Utilizes DRIE systems and E-beam or photolithography tools. Requires CMMC Level 1 and cleanroom standards. Delivers fabricated wafers demonstrating 100:1 aspect ratios.

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