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This Government Contract opportunity from Department Of Defense was posted on October 27, 2025. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

PCB Assembly and Fabrication

Closed
Federal

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This subcontract opportunity is issued by the Defense Microelectronics Activity under the Department of Defense for comprehensive PCB assembly and fabrication services. The scope of work encompasses the full lifecycle of production, including component placement, soldering, and the integration of circuit card assemblies, with requirements that may scale from initial design phases to full volume production. The contract is designated as a Total Small Business Set-Aside under NAICS code 334418. Interested parties must submit their responses by October 31, 2025. Performance for this contract will take place in Rancho Dominguez, California.

General Info

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

E RNCHO DMNGZ, CA, 95652, USA

Set-Aside

SBA

Documents

This scope was carved out of HQ072725RSW01.

The full solicitation package (7 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Microelectronics Systems Integration Indefinite Delivery/Indefinite Quantity (IDIQ)

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Microelectronics Activity
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Full lifecycle PCB assembly including component placement, soldering, and integration into circuit card assemblies (CCAs), potentially spanning from design to volume production.

More opportunities from Department Of Defense → Defense Microelectronics Activity

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