Photodiode Fabrication & Packaging (TO5 and Coaxial)

The contract calls for the full fabrication of six photodiodes including mesa etching, passivation, metallization, fiber coupling, and packaging in both TO5 and coaxial configurations, requiring precise semiconductor processing and integrated packaging techniques. All work must be performed in accordance with technical specifications for optical performance, reliability, and environmental robustness, with final deliverables meeting stringent military-grade standards. The work is designated as a Total Small Business Set-Aside under SBA guidelines, ensuring exclusive participation by small business concerns as defined by the FAR, and is classified under NAICS code 334418 for other semiconductor and related device manufacturing. Performance of the contract is mandated to take place at Wright Patterson AFB, Ohio, with a response deadline of July 31, 2026, and the solicitation was posted on July 21, 2026. This is a subcontract under the Department of Defense, specifically managed by the USAF AFMC ARL PZL, and no point of contact information is provided in the public record. The nature of the work suggests integration into defense or aerospace optical systems, requiring traceability, quality control, and compliance with applicable DoD procurement regulations throughout fabrication and packaging.