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ROIC Integration and Testing

Active

Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract involves the integration and testing of Readout Integrated Circuits (ROICs) with directly bonded Focal Plane Arrays (FPAs), focusing on ensuring high signal fidelity and optimal operational performance within infrared systems. The work is aimed at advancing the capability and reliability of these components, which are critical for infrared sensing applications. This subcontract, titled "ROIC Integration and Testing," was posted by the Department of Defense on May 27, 2026, with a specified place of performance at Fort Belvoir. It falls under the NAICS code 334412, which relates to electronic component manufacturing. The contract supports a key defense technology initiative, ensuring that integrated ROICs and FPAs function seamlessly together to meet rigorous performance standards required for defense infrared systems.

General Info

Department of Defense contract for ROIC and FPA integration, testing at Fort Belvoir, enhancing infrared systems.

Agency

Department Of Defense → W6QK Acc-Apg

NAICS

334412 - Bare Printed Circuit Board Manufacturing View NAICS

Place of Performance

Fort Belvoir, VA, USA

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

PostedMay 27

subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → W6QK Acc-Apg

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → W6QK Acc-Apg

Office AddressN/A

ContactsNo contact information available

Full Description

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Integrate and test ROICs with directly bonded FPAs to ensure signal fidelity and operational performance in infrared systems.

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