Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays

The contract W56KGU26CA004, awarded to DRS Network & Imaging Systems, LLC, is a sole-source, Cost-Plus-Fixed-Fee arrangement for the development of direct bonding techniques for compound semiconductors to enhance dual-band infrared focal plane arrays, eliminating infrared-absorbing epoxy to improve sensitivity and manufacturing yield. The project, with a total estimated ceiling of $8.4 million and a 36-month performance period, is aligned with OSD and Army ManTech initiatives and supports 3GEN FLIR, DAIRCM, and SM3 programs through the production of high-definition long-wave focal plane arrays using ZnS-based hybridization. Work is to be performed at Fort Belvoir, Virginia, while the contractor is based in Melbourne, Florida. The acquisition was justified under FAR 6.302-1(a)(2)(ii)(A) due to the unique technical capabilities of the contractor, with no alternatives available that meet the government’s requirements, and the award process followed a trade-off evaluation rather than low-price technically acceptable. Compliance with subcontracting regulations is mandated through FAR 52.219-8, FAR 52.219-9, FAR 52.244-5, and DFARS 252.219-7003, with certified cost or pricing data required under FAR 15.403 due to the contract value exceeding $900,000. Funding originates from RDT&E FY26–28 Mantech appropriations. The contractor’s Unique Entity ID is MC27B7LGBL34 and CAGE code is 32865. No detailed pricing structure, delivery schedule, inspection locations, or specific packaging, preservation, or marking requirements are specified in the documentation. While the government is responsible for acceptance, and the C5ISR Center holds authority over formal approval, no names or contact details for the Contracting Officer, COR, COTR, or PCO are provided. Delivery terms, FOB conditions, invoicing methods, and remittance details are also absent. The contract references compliance with FAR and DFARS clauses related to subcontracting and cost transparency but does not cite formal MIL-STDs for packaging or marking. Attachments, evaluation factor weights, adjectival ratings, or detailed technical specifications beyond the scope of direct bonding and hybridization are not included. The solicitation was issued as a source-s